XC3S50-5CPG132C

IC FPGA 89 I/O 132CSBGA
Part Description

Spartan®-3 Field Programmable Gate Array (FPGA) IC 89 73728 1728 132-TFBGA, CSPBGA

Quantity 1,353 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package132-CSPBGA (8x8)GradeCommercialOperating Temperature0°C – 85°C
Package / Case132-TFBGA, CSPBGANumber of I/O89Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs192Number of Logic Elements/Cells1728
Number of Gates50000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of XC3S50-5CPG132C – Spartan®-3 Field Programmable Gate Array (FPGA) IC 89 73728 1728 132-TFBGA, CSPBGA

The XC3S50-5CPG132C is a Spartan®-3 Field Programmable Gate Array (FPGA) from AMD, provided in a 132-ball TFBGA/CSPBGA package. It delivers a compact, moderate-density programmable logic fabric suitable for custom digital implementations that require on-chip memory, a defined I/O count, and a low-voltage supply.

Key Features

  • Core Logic  1,728 logic elements organized across 192 CLBs to implement custom combinational and sequential logic.
  • Embedded Memory  73,728 bits of on-chip RAM (approximately 0.074 Mbits) for local data storage and buffering.
  • I/O Capacity  89 user I/Os to interface with external peripherals and subsystems.
  • Gate Equivalent  Functional capacity equivalent to approximately 50,000 gates for moderate-complexity designs.
  • Power  Specified supply voltage range from 1.14 V to 1.26 V.
  • Package & Mounting  132-TFBGA / CSPBGA (supplier package: 132-CSPBGA 8×8) in a surface-mount form factor for space-constrained boards.
  • Operating Temperature  Commercial-grade operation from 0 °C to 85 °C.
  • Regulatory  RoHS compliant for lead-free manufacturing processes.

Typical Applications

  • Custom digital logic implementations  Use the 1,728 logic elements and ~50,000-gate capacity to realize bespoke control and processing functions.
  • Embedded systems with on-chip memory needs  Utilize the 73,728 bits of embedded RAM for local buffering, state storage, and small data caches.
  • Compact, board-level designs  The 132-ball CSPBGA surface-mount package supports small form-factor PCBs requiring substantial I/O and programmable logic.

Unique Advantages

  • Moderate logic density: 1,728 logic elements provide a balanced amount of programmable resources for mid-range designs without excessive complexity.
  • On-chip RAM available: 73,728 bits of embedded memory reduce external memory dependence for control and buffering tasks.
  • Defined I/O count: 89 I/Os simplify board-level planning for interfacing sensors, peripherals, and external logic.
  • Compact BGA packaging: 132-TFBGA/CSPBGA option enables space-saving PCB layouts while maintaining connection density.
  • Low-voltage operation: 1.14 V–1.26 V supply range supports designs targeting lower core voltages.
  • RoHS compliant: Suitable for lead-free assembly processes and environmentally conscious manufacturing.

Why Choose XC3S50-5CPG132C?

The XC3S50-5CPG132C positions itself as a compact, commercial-grade FPGA option for engineers needing a moderate amount of programmable logic, embedded RAM, and a fixed I/O complement in a space-efficient BGA package. Its specified supply voltage and operating temperature range make it appropriate for commercial electronic products and prototypes where on-chip memory and a defined gate count matter.

Choose this device when you require scalable, vendor-backed FPGA technology with clear, verifiable specifications for logic capacity, memory, I/O, package, and thermal limits—helping streamline design choices and BOM planning for mid-density programmable designs.

Request a quote or submit a purchase inquiry to obtain pricing, availability, and lead-time details for the XC3S50-5CPG132C.

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