XC3S5000-5FG900C

The XC3S5000-5FG900C is a Spartan®-3 field programmable gate array (FPGA) provided in a 900-ball BGA package. It delivers a combination of high logic capacity, on-chip memory, and large I/O availability suitable for complex programmable logic implementations.

With 74,880 logic elements, approximately 1.92 Mbits of embedded memory, and 633 user I/O pins, this commercial-grade FPGA supports designs that require significant gate density, on-chip storage, and broad I/O connectivity while operating within a 1.14 V to 1.26 V supply window and a 0 °C to 85 °C temperature range.

Key Features

• Core Logic 74,880 logic elements providing substantial programmable logic capacity for a wide range of digital designs.
• Embedded Memory Approximately 1.92 Mbits of on-chip RAM to support buffering, lookup tables, and temporary storage without external memory.
• High I/O Count 633 user I/O pins to enable extensive external interfacing and parallel connectivity.
• Gate Equivalent 5,000,000 gates of equivalent logic capacity for implementing complex state machines and combinational logic.
• Power and Operating Range Core supply range from 1.14 V to 1.26 V, with commercial operating temperature from 0 °C to 85 °C.
• Package and Mounting 900-BBGA package (supplier device package: 900-FBGA 31×31) optimized for surface-mount assembly.
• Regulatory RoHS compliant.

Typical Applications

• High-density digital logic implementations — Designs requiring up to 74,880 logic elements and 5,000,000 gate-equivalents benefit from the device's logic capacity.
• Memory-assisted processing — Projects that need on-chip buffering or lookup storage can leverage approximately 1.92 Mbits of embedded RAM.
• Systems with extensive external connectivity — Applications demanding numerous parallel interfaces or many signal lines can make use of the 633 available I/O pins.

Unique Advantages

• High usable logic capacity: 74,880 logic elements enable the integration of complex custom logic on a single device, reducing board-level complexity.
• Significant on-chip memory: Approximately 1.92 Mbits of embedded RAM minimizes dependence on external memory for intermediate storage and accelerates data-path implementations.
• Extensive I/O resources: 633 user I/O pins allow flexible interfacing with sensors, peripherals, and parallel buses without extensive external multiplexing.
• Compact, production-ready package: 900-BBGA (900-FBGA 31×31) surface-mount package supports dense board layouts and automated assembly processes.
• Commercial temperature and RoHS compliance: Maintains operation across a 0 °C to 85 °C range and meets RoHS requirements for regulatory compliance.

Why Choose XC3S5000-5FG900C?

The XC3S5000-5FG900C positions itself as a high-capacity Spartan®-3 FPGA option for designers who need a balance of logic density, on-chip memory, and extensive I/O in a surface-mount BGA form factor. Its combination of 74,880 logic elements, roughly 1.92 Mbits of embedded RAM, and 633 I/O pins supports consolidation of complex functions onto a single programmable device.

This part is suitable for commercial applications that require significant integration and scalability while operating within a defined voltage and temperature envelope. RoHS compliance and a production-ready 900-BBGA package support standard manufacturing flows and environmental requirements.

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