XC3S500E-4PQ208C

IC FPGA 158 I/O 208QFP
Part Description

Spartan®-3E Field Programmable Gate Array (FPGA) IC 158 368640 10476 208-BFQFP

Quantity 407 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O158Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1164Number of Logic Elements/Cells10476
Number of Gates500000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits368640

Overview of XC3S500E-4PQ208C – Spartan®-3E FPGA, 208-BFQFP

The XC3S500E-4PQ208C is a Spartan®-3E field programmable gate array (FPGA) in a 208-pin BFQFP package from AMD. It provides a programmable logic fabric with 1,164 logic blocks (CLBs), 10,476 logic elements and approximately 0.37 Mbits of embedded RAM for implementating custom digital functions.

With 158 user I/O, a supply voltage range of 1.14 V to 1.26 V, and commercial-grade operation from 0 °C to 85 °C, this device targets applications that require moderate logic capacity, on-chip memory and flexible I/O in a surface-mount package.

Key Features

  • Logic Fabric  1,164 CLBs (logic blocks) providing 10,476 logic elements for implementing custom combinational and sequential logic.
  • Embedded Memory  Approximately 0.37 Mbits of on-chip RAM (368,640 bits) for buffering, FIFOs and small-data storage tasks.
  • Gates  Equivalent to 500,000 gates, enabling mid-range digital integration within a single device.
  • I/O Count  158 general-purpose I/O pins to interface with peripherals, sensors and external logic.
  • Package and Mounting  208-BFQFP package; supplier device package listed as 208-PQFP (28×28). Surface-mount mounting type for PCB assembly.
  • Power  Core supply range of 1.14 V to 1.26 V to match target system power rails.
  • Temperature and Grade  Commercial grade operation from 0 °C to 85 °C.
  • Environmental  RoHS compliant.

Typical Applications

  • Embedded control systems  Use the device's logic elements and on-chip RAM to implement custom control logic, finite-state machines and interface controllers.
  • Peripheral interfacing  Leverage 158 I/O pins for bridging between sensors, ADCs/DACs and host processors or for custom bus implementations.
  • Prototyping and evaluation  Applicable where a programmable logic element with mid-range capacity is needed to validate digital designs before final integration.

Unique Advantages

  • Balanced logic and memory capacity: Combines 10,476 logic elements with approximately 0.37 Mbits of embedded RAM to support state machines, buffering and mid-sized datapaths without external memory.
  • Generous I/O count: 158 user I/O pins provide flexibility for connecting multiple peripherals or implementing parallel interfaces.
  • Compact surface-mount package: 208-BFQFP (supplier device package 208-PQFP 28×28) enables dense PCB layouts while maintaining accessible pin count.
  • Defined power envelope: Specified core supply range (1.14 V to 1.26 V) facilitates integration into systems with narrow power rails.
  • Commercial temperature rating: Operation from 0 °C to 85 °C suits a wide range of commercial and consumer applications.
  • RoHS compliant: Meets lead-free and restricted substance requirements for compliant product builds.

Why Choose XC3S500E-4PQ208C?

The XC3S500E-4PQ208C positions itself as a mid-range Spartan®-3E FPGA offering a practical combination of logic elements, on-chip memory and I/O for designers needing programmable hardware in a surface-mount 208-pin package. Its voltage and temperature specifications make it suitable for commercial designs that require an integrated, programmable solution without external memory for many control and interface tasks.

Designed and supplied by AMD, the device provides a predictable, verifiable set of resources—logic elements, CLBs, embedded RAM and I/O—that support scalable prototyping and deployment in volume designs where moderate programmable logic capacity and RoHS compliance are required.

Request a quote or submit an inquiry for the XC3S500E-4PQ208C to receive pricing and availability information specific to your project needs.

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