XC3S500E-4PQ208C
| Part Description |
Spartan®-3E Field Programmable Gate Array (FPGA) IC 158 368640 10476 208-BFQFP |
|---|---|
| Quantity | 407 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 158 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1164 | Number of Logic Elements/Cells | 10476 | ||
| Number of Gates | 500000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 368640 |
Overview of XC3S500E-4PQ208C – Spartan®-3E FPGA, 208-BFQFP
The XC3S500E-4PQ208C is a Spartan®-3E field programmable gate array (FPGA) in a 208-pin BFQFP package from AMD. It provides a programmable logic fabric with 1,164 logic blocks (CLBs), 10,476 logic elements and approximately 0.37 Mbits of embedded RAM for implementating custom digital functions.
With 158 user I/O, a supply voltage range of 1.14 V to 1.26 V, and commercial-grade operation from 0 °C to 85 °C, this device targets applications that require moderate logic capacity, on-chip memory and flexible I/O in a surface-mount package.
Key Features
- Logic Fabric 1,164 CLBs (logic blocks) providing 10,476 logic elements for implementing custom combinational and sequential logic.
- Embedded Memory Approximately 0.37 Mbits of on-chip RAM (368,640 bits) for buffering, FIFOs and small-data storage tasks.
- Gates Equivalent to 500,000 gates, enabling mid-range digital integration within a single device.
- I/O Count 158 general-purpose I/O pins to interface with peripherals, sensors and external logic.
- Package and Mounting 208-BFQFP package; supplier device package listed as 208-PQFP (28×28). Surface-mount mounting type for PCB assembly.
- Power Core supply range of 1.14 V to 1.26 V to match target system power rails.
- Temperature and Grade Commercial grade operation from 0 °C to 85 °C.
- Environmental RoHS compliant.
Typical Applications
- Embedded control systems Use the device's logic elements and on-chip RAM to implement custom control logic, finite-state machines and interface controllers.
- Peripheral interfacing Leverage 158 I/O pins for bridging between sensors, ADCs/DACs and host processors or for custom bus implementations.
- Prototyping and evaluation Applicable where a programmable logic element with mid-range capacity is needed to validate digital designs before final integration.
Unique Advantages
- Balanced logic and memory capacity: Combines 10,476 logic elements with approximately 0.37 Mbits of embedded RAM to support state machines, buffering and mid-sized datapaths without external memory.
- Generous I/O count: 158 user I/O pins provide flexibility for connecting multiple peripherals or implementing parallel interfaces.
- Compact surface-mount package: 208-BFQFP (supplier device package 208-PQFP 28×28) enables dense PCB layouts while maintaining accessible pin count.
- Defined power envelope: Specified core supply range (1.14 V to 1.26 V) facilitates integration into systems with narrow power rails.
- Commercial temperature rating: Operation from 0 °C to 85 °C suits a wide range of commercial and consumer applications.
- RoHS compliant: Meets lead-free and restricted substance requirements for compliant product builds.
Why Choose XC3S500E-4PQ208C?
The XC3S500E-4PQ208C positions itself as a mid-range Spartan®-3E FPGA offering a practical combination of logic elements, on-chip memory and I/O for designers needing programmable hardware in a surface-mount 208-pin package. Its voltage and temperature specifications make it suitable for commercial designs that require an integrated, programmable solution without external memory for many control and interface tasks.
Designed and supplied by AMD, the device provides a predictable, verifiable set of resources—logic elements, CLBs, embedded RAM and I/O—that support scalable prototyping and deployment in volume designs where moderate programmable logic capacity and RoHS compliance are required.
Request a quote or submit an inquiry for the XC3S500E-4PQ208C to receive pricing and availability information specific to your project needs.

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