XC3S500E-4VQG100C

The XC3S500E-4VQG100C is an AMD Spartan®-3E family FPGA supplied in a 100-TQFP package for surface-mount PCB integration. It provides a mid-range programmable logic solution with 10,476 logic elements and approximately 0.37 Mbits of on-chip RAM for wiring custom digital functions.

With 66 user I/O pins, roughly 500,000 gates of logic capacity, a nominal supply range of 1.14 V to 1.26 V, and commercial operating range from 0 °C to 85 °C, this device targets embedded designs that need moderate logic density, on-chip memory buffering, and compact packaging.

Key Features

• Core Logic Capacity — 10,476 logic elements and approximately 500,000 gates provide the programmable resources for glue logic, state machines, and custom digital functions.
• Embedded Memory — 368,640 bits of on-chip RAM (approximately 0.37 Mbits) for data buffering, FIFOs, and small local storage without external memory.
• I/O Count — 66 user I/O pins suitable for interfacing to peripherals, sensors, and external devices at the board level.
• Power Supply — Operates from a supply range of 1.14 V to 1.26 V, supporting designs with defined core-voltage requirements.
• Package and Mounting — 100-TQFP package (100-VQFP, 14 × 14 mm) in a surface-mount form factor for compact PCB layouts.
• Operating Conditions — Commercial grade device specified for 0 °C to 85 °C ambient operation.
• Compliance — RoHS compliant, meeting lead-free environmental requirements for many commercial electronics designs.

Typical Applications

• Embedded Control — Implement control logic, protocol translators, and custom state machines using the device’s logic elements and on-chip RAM.
• Consumer Electronics — Integrate user-interface control, peripheral glue logic, and data buffering in compact, surface-mounted designs.
• Communications Peripherals — Use the FPGA’s logic capacity and embedded memory for packet buffering, simple framing, or interface bridging tasks.
• Prototyping and Evaluation — Ideal for developers needing a commercially graded, moderate-capacity FPGA in a 100-TQFP package for board-level prototypes and evaluation.

Unique Advantages

• Balanced Logic and Memory: Combines 10,476 logic elements with approximately 0.37 Mbits of embedded RAM to support mixed logic-plus-buffering designs without immediate external memory.
• Compact Surface-Mount Package: The 100-TQFP (14 × 14 mm) package enables dense PCB layouts while keeping device placement and routing straightforward.
• Clear Operating Range: Commercial temperature specification (0 °C to 85 °C) and defined supply range (1.14 V–1.26 V) simplify power and thermal planning for mainstream applications.
• Sufficient I/O Count: Sixty-six user I/Os provide practical connectivity for peripheral interfacing, sensor integration, and control signals on compact boards.
• Regulatory-Conscious: RoHS compliance supports environmentally driven production requirements for commercial electronics.

Why Choose XC3S500E-4VQG100C?

The XC3S500E-4VQG100C delivers a practical combination of logic density, on-chip memory, and I/O count in a surface-mount 100-TQFP package, making it well suited to commercial embedded designs that require moderate FPGA resources. Its defined voltage and temperature specifications help streamline power delivery and thermal considerations during development.

This device is a fit for teams and integrators looking for a commercially graded Spartan®-3E FPGA from AMD with a balance of programmable logic and memory for board-level implementations, prototyping, and medium-complexity digital functions.

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