XC3S500E-5CPG132C

The XC3S500E-5CPG132C is a Spartan®-3E Field Programmable Gate Array (FPGA) IC from AMD, offered in a 132-TFBGA/CSPBGA package. It provides a mid-range, reconfigurable logic resource with approximately 10,476 logic elements, embedded RAM, and a 92-pin I/O complement suitable for commercial electronic designs.

Designed for commercial-grade applications, this device combines configurable logic density, on-chip memory, and a compact surface-mount package to address a variety of programmable-logic needs where integration and board-space efficiency are important.

Key Features

• Core Logic  Approximately 10,476 logic elements (corresponding to about 1,164 configurable logic blocks), delivering mid-range programmable logic capacity for custom digital functions.
• Embedded Memory  Approximately 368,640 bits of on-chip RAM to support data buffering, small FIFOs, and control-state storage.
• I/O Resources  92 user I/Os to interface with external peripherals, sensors, and buses for flexible system integration.
• Gate Count  Approximately 500,000 gates providing an aggregate measure of the device’s logic capacity for synthesis and fit assessments.
• Power  Operates from a core supply range of 1.14 V to 1.26 V, enabling predictable power budgeting for the FPGA core.
• Package & Mounting  132-TFBGA / 132-CSPBGA (8×8) surface-mount package for compact board integration and automated assembly.
• Operating Range  Commercial temperature grade with an operating range of 0 °C to 85 °C, suitable for standard commercial environments.
• Compliance  RoHS compliant, supporting lead-free manufacturing and environmental compliance requirements.

Typical Applications

• Custom digital logic and prototyping  Reconfigurable logic capacity and embedded RAM make the device suitable for implementing custom state machines, protocol logic, and early-stage prototypes.
• Embedded control and glue logic  Use the FPGA to consolidate discrete logic, manage control paths, and implement glue logic between digital subsystems.
• I/O expansion and interface bridging  The 92 I/Os support taking on additional peripheral interfaces or bridging between different bus standards on compact PCBs.
• Commercial electronic systems  The commercial operating range and compact 132-TFBGA package suit low- to mid-volume commercial products where space and RoHS compliance matter.

Unique Advantages

• Right-sized logic density: Approximately 10,476 logic elements provide a balance of capacity and cost for mid-range programmable designs.
• On-chip RAM availability: Approximately 368,640 bits of embedded memory reduce the need for external RAM for small buffering and control functions, simplifying BOM and layout.
• Ample I/O in a compact footprint: 92 I/Os in a 132-pin CSPBGA package enable flexible external connectivity without a large-package penalty.
• Defined power envelope: A clear core voltage range (1.14 V to 1.26 V) helps with power supply design and system-level power planning.
• Commercial readiness and compliance: Commercial-grade temperature range (0 °C to 85 °C) and RoHS compliance align with standard commercial product requirements.

Why Choose XC3S500E-5CPG132C?

The XC3S500E-5CPG132C offers a practical combination of logic capacity, embedded memory, and I/O resources in a compact 132-TFBGA surface-mount package for commercial electronic designs. Its specifications make it well suited to engineers who need mid-range programmable logic with on-chip RAM and a clearly defined power and temperature envelope.

For teams working on prototypes, control logic consolidation, or commercial products with space-constrained PCBs, this FPGA provides a balanced, verifiable option sourced from AMD with RoHS compliance.

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