XC3S500E-5PQG208C

The XC3S500E-5PQG208C is a Spartan®-3E Field Programmable Gate Array (FPGA) IC from AMD supplied in a 208-BFQFP package. It delivers a balance of logic capacity, on-chip memory and I/O density for commercial temperature applications.

Key on-chip resources include 10,476 logic elements, approximately 0.369 Mbits of embedded memory, and 158 I/Os, with a core supply range of 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity — 10,476 logic elements organized across 1,164 configurable logic blocks (CLBs) to implement custom digital functions.
• Embedded Memory — Approximately 0.369 Mbits of on-chip RAM (368,640 bits) to support buffering, state machines and custom data paths.
• I/O and Gate Count — 158 general-purpose I/Os and an equivalent of 500,000 gates for interfacing and mid-range integration.
• Power — Core voltage supply range of 1.14 V to 1.26 V for the FPGA core.
• Package and Mounting — 208-BFQFP package (supplier device package: 208-PQFP, 28 × 28 mm) with surface-mount construction for PCB integration.
• Operating Range — Commercial grade operation from 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• Prototyping and Development — Use the device's 10,476 logic elements and on-chip RAM for proof-of-concept designs and hardware validation.
• Custom Digital Logic — Implement medium-complexity state machines, signal processing pipelines or glue logic leveraging available gates and CLBs.
• I/O-Intensive Interfaces — Deploy in designs requiring a moderate number of external interfaces using up to 158 I/Os for peripheral connectivity.

Unique Advantages

• Balanced Logic and Memory: 10,476 logic elements combined with ~0.369 Mbits of embedded RAM provide resources for a wide range of mid-scale designs without external memory.
• Generous I/O Count: 158 I/Os enable flexible interfacing to sensors, peripherals and other system components, reducing the need for external I/O expanders.
• Compact Package Options: 208-BFQFP (208-PQFP, 28 × 28 mm) surface-mount package supports compact PCB layouts while maintaining accessibility to pins.
• Low-Voltage Core: Narrow core supply range (1.14 V–1.26 V) supports consistent power budgeting for the FPGA core.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C operation to meet standard commercial deployment requirements.
• RoHS Compliant: Environmentally compliant for regions and programs that require lead-free components.

Why Choose XC3S500E-5PQG208C?

The XC3S500E-5PQG208C positions itself as a practical solution for designers needing a mid-range FPGA with a balanced mix of logic elements, embedded memory and I/O resources in a compact surface-mount package. Its specified core voltage range and commercial temperature rating make it suitable for a variety of standard embedded applications.

Manufactured by AMD, this Spartan®-3E device is appropriate for teams and projects that require deterministic on-chip resources and a clear set of electrical and thermal specifications to guide system integration and procurement decisions.

Request a quote or submit an inquiry to receive pricing, availability and ordering information for the XC3S500E-5PQG208C. Our team can provide the next steps to move this FPGA into your design cycle.