XC3S50A-4FTG256C

The XC3S50A-4FTG256C is a Spartan®-3A Field Programmable Gate Array (FPGA) IC from AMD, provided in a 256-LBGA package. It delivers mid-range logic capacity with a combination of programmable logic, embedded memory, and a substantial I/O complement for commercial-grade designs.

With 1,584 logic elements, approximately 0.055 Mbits of embedded memory, and 144 user I/O, this device is intended for commercial applications that require balanced logic density, on-chip storage, and flexible interfacing within a compact surface-mount package.

Key Features

• Programmable Logic  1,584 logic elements and an advertised 50,000 gates provide mid-range, reconfigurable logic capacity for custom digital designs.
• Embedded Memory  Approximately 0.055 Mbits (55,296 bits) of on-chip RAM for state storage, buffering, and small data structures.
• I/O Capability  144 user I/O pins supporting a variety of interfacing requirements in commercial systems.
• Package and Mounting  256-LBGA package (supplier package: 256-FTBGA, 17×17) in a surface-mount form factor for compact board implementation.
• Power  Core supply specified from 1.14 V to 1.26 V to meet the device’s operating requirements.
• Operating Range and Grade  Commercial grade operation with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• Commercial Embedded Systems  Integrate custom logic and peripherals where mid-range programmable capacity and a high I/O count are required.
• Prototyping and Development  Use for digital logic prototyping and proof-of-concept designs that need reconfigurable hardware resources.
• Custom Control and Glue Logic  Implement device-specific control functions, protocol bridging, and glue logic in commercial equipment.

Unique Advantages

• Balanced Logic Density:  1,584 logic elements provide a middle-ground resource set suitable for many commercial FPGA use cases without excessive overhead.
• On-chip RAM for Local Storage:  Approximately 0.055 Mbits of embedded memory enables local buffering and state machines without external memory.
• High I/O Count:  144 I/O pins support complex interfacing and multiple peripheral connections on a single device.
• Compact Surface-Mount Package:  256-LBGA (256-FTBGA, 17×17) facilitates space-efficient PCB layouts and high-density assemblies.
• Low-Voltage Core:  Core supply range of 1.14 V to 1.26 V aligns with modern low-voltage FPGA power domains.
• RoHS Compliant:  Meets RoHS requirements for environmentally conscious manufacturing and assembly.

Why Choose XC3S50A-4FTG256C?

The XC3S50A-4FTG256C from AMD positions itself as a compact, commercial-grade FPGA option that combines mid-range programmable logic, embedded RAM, and a high I/O count in a 256-LBGA surface-mount package. Its specifications make it suitable for designers seeking a balance of logic capacity and interfacing capability without moving to larger, higher-cost devices.

This part is appropriate for commercial projects that require reconfigurable logic, moderate on-chip memory, and a robust I/O complement, all provided by a recognized FPGA manufacturer. RoHS compliance and a defined operating temperature range provide predictable integration into commercial product designs.

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