XC3S50A-4TQG144C

The XC3S50A-4TQG144C is a Spartan®-3A field programmable gate array (FPGA) IC from AMD supplied in a 144-pin LQFP package. It provides a balanced combination of programmable logic, embedded memory and I/O for commercial embedded designs.

With 1,584 logic elements, approximately 55 kbits of on-chip RAM, and 108 user I/Os, this device targets compact board-level applications that require moderate logic capacity, flexible interfacing and standard surface-mount packaging.

Key Features

• Core Logic 1,584 logic elements (cells) suitable for implementing custom logic functions and moderate-complexity designs.
• Embedded Memory Total on-chip RAM of 55,296 bits (approximately 55 kbits) for buffering, small FIFOs and distributed storage.
• I/O Count 108 general-purpose I/O pins to support multiple interfaces and external peripherals on a single device.
• Gate Equivalents Approximately 50,000 gates, providing a practical metric for overall device capacity in gate-based sizing.
• Power Supply Core supply voltage range of 1.14 V to 1.26 V to match targeted system power rails and design requirements.
• Package and Mounting 144-LQFP package case; supplier device package listed as 144-TQFP (20×20), with surface-mount mounting for compact PCB integration.
• Operating Range and Grade Commercial device grade with an operating temperature range of 0 °C to 85 °C for standard commercial environments.
• RoHS Compliance Device is RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Commercial Embedded Systems — Implement custom control, glue-logic and interface functions in commercial-grade embedded products.
• I/O-Intensive Control — Use the 108 I/Os for multi-channel sensor interfacing, peripheral bridging and board-level control tasks.
• Compact Board Designs — The 144-LQFP surface-mount package supports dense PCB layouts where standard package dimensions and mounting are required.

Unique Advantages

• Right-sized Logic Capacity: 1,584 logic elements provide a practical balance between capability and cost for moderate-complexity designs.
• Integrated On-chip Memory: Approximately 55 kbits of embedded RAM simplifies buffering and local data storage without external memory.
• Generous I/O Count: 108 I/Os enable flexible interfacing to sensors, peripherals and external logic without expanding BOM.
• Standard Surface-mount Package: 144-LQFP / 144-TQFP (20×20) package size facilitates straightforward board-level assembly and manufacturing.
• Commercial Temperature Rating: 0 °C to 85 °C supports typical commercial environments and applications.
• Regulatory Alignment: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose XC3S50A-4TQG144C?

The XC3S50A-4TQG144C positions itself as a practical Spartan®-3A FPGA option for designers who need a mid-range programmable logic device with solid I/O capability and on-chip memory in a standard 144-pin surface-mount package. Its combination of approximately 1,584 logic elements, ~55 kbits of embedded RAM and 108 I/Os makes it well suited to compact commercial embedded applications that require custom logic and flexible interfacing.

Backed by AMD manufacturing and RoHS compliance, this device provides a predictable platform for projects where commercial-grade temperature range, standard packaging and a defined core supply range (1.14 V–1.26 V) are important for design and production planning.

Request a quote or submit an inquiry to receive pricing and availability for the XC3S50A-4TQG144C and to discuss suitability for your design requirements.