XC3S50A-4VQ100I

IC FPGA 68 I/O 100VQFP
Part Description

Spartan®-3A Field Programmable Gate Array (FPGA) IC 68 55296 1584 100-TQFP

Quantity 1,463 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package100-VQFP (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case100-TQFPNumber of I/O68Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs176Number of Logic Elements/Cells1584
Number of Gates50000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of XC3S50A-4VQ100I – Spartan®-3A Field Programmable Gate Array (FPGA) IC, 1,584 logic elements, 68 I/O, 100-TQFP

The XC3S50A-4VQ100I is a Spartan®-3A Field Programmable Gate Array (FPGA) IC tailored for systems that require reconfigurable digital logic with on-chip memory and flexible I/O. Its architecture delivers 176 configurable logic blocks (CLBs) providing 1,584 logic elements, along with embedded RAM and a 68-pin I/O complement.

Designed for industrial-grade environments, the device combines moderate logic density, on-chip memory, and a compact 100-TQFP package to support space-constrained, board-level implementations that need programmable logic and deterministic operating-temperature performance.

Key Features

  • Core Logic 176 configurable logic blocks (CLBs) providing 1,584 logic elements and an estimated 50,000 equivalent gates for implementing custom digital functions.
  • Embedded Memory Total on-chip RAM of 55,296 bits (approximately 0.055 Mbits) to support small FIFOs, buffers, and control-state storage.
  • I/O Capacity 68 general-purpose I/O pins for interfacing with peripherals, sensors, and external logic.
  • Power Core voltage supply range from 1.14 V to 1.26 V to match system power domains and regulator designs.
  • Package & Mounting 100-TQFP package (supplier device package: 100-VQFP, 14 × 14 mm) in a surface-mount form factor for PCB-level integration where board space is constrained.
  • Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet a broad set of industrial ambient conditions.
  • Regulatory RoHS-compliant for lead-free assembly and regulatory alignment.

Unique Advantages

  • Balanced Logic Density: 1,584 logic elements and ~50,000 equivalent gates provide sufficient resources for medium-complexity programmable designs without excessive footprint.
  • On-Chip Memory: 55,296 bits of embedded RAM reduce the need for external memory in control and buffering tasks, simplifying board design.
  • Flexible I/O: 68 I/O pins support multiple peripheral interfaces and custom signal routing for system integration.
  • Industrial Reliability: Rated for −40 °C to 100 °C operation, suitable for industrial environments requiring extended temperature tolerance.
  • Compact Surface-Mount Package: 100-TQFP (100-VQFP, 14 × 14 mm) enables PCB designs with limited area while maintaining accessible pinout for routing.
  • Low-Voltage Core: 1.14–1.26 V supply range aligns with modern low-voltage power architectures.

Why Choose XC3S50A-4VQ100I?

The XC3S50A-4VQ100I positions itself as a practical, industrial-grade FPGA choice for designs needing moderate programmable logic, embedded RAM, and a compact, surface-mount footprint. Its combination of 1,584 logic elements, 68 I/O, and a 100-TQFP package provides a balance of integration and board-level flexibility for control, interfacing, and custom digital functions.

Manufactured by AMD and RoHS-compliant, the device offers consistent operating behavior across −40 °C to 100 °C and a defined low-voltage core supply, making it suitable for long-term deployments where industrial temperature range and deterministic supply requirements matter.

Request a quote or submit an inquiry to receive pricing and availability for the XC3S50A-4VQ100I.

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