XC3S50A-5TQG144C
| Part Description |
Spartan®-3A Field Programmable Gate Array (FPGA) IC 108 55296 1584 144-LQFP |
|---|---|
| Quantity | 1,038 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 108 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 176 | Number of Logic Elements/Cells | 1584 | ||
| Number of Gates | 50000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of XC3S50A-5TQG144C – Spartan®-3A FPGA (144-LQFP)
The XC3S50A-5TQG144C is a Spartan®-3A Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 144-lead LQFP package. It provides a commercial-grade, surface-mount programmable logic solution with 1.14 V to 1.26 V core supply requirements and an operating temperature range of 0 °C to 85 °C.
With 1,584 logic elements, 176 CLBs and 55,296 bits of on-chip RAM paired with 108 I/O pins and an estimated 50,000 gates, this device is intended for designers who need compact, programmable logic density in a 144-pin TQFP/LQFP footprint.
Key Features
- Core Logic Provides 1,584 logic elements and 176 CLBs, enabling moderate-density programmable logic implementations.
- On-chip Memory Includes 55,296 bits of embedded RAM for local storage and buffering needs within the FPGA fabric.
- I/O Capacity Offers 108 general-purpose I/O pins to interface with external devices and peripherals.
- Logic Gate Count Approximately 50,000 gates of logic capacity for combinational and sequential designs.
- Power Supply Core voltage specified between 1.14 V and 1.26 V to match system power requirements.
- Package & Mounting Supplied in a 144-LQFP package (supplier designation: 144-TQFP, 20×20) optimized for surface-mount assembly.
- Commercial Grade Temperature Rated for operation from 0 °C to 85 °C to meet commercial application temperature ranges.
- RoHS Compliant Manufactured in compliance with RoHS requirements.
Unique Advantages
- Balanced Logic and Memory: Combines 1,584 logic elements with 55,296 bits of embedded RAM to support designs that require both logic density and local data storage.
- Generous I/O Count: 108 I/O pins provide flexibility for interfacing multiple peripherals or external subsystems without changing package family.
- Compact, Standard Package: Available in a 144-LQFP / 144-TQFP (20×20) package that fits standard PCB footprints and surface-mount assembly processes.
- Commercial Temperature Rating: Rated 0 °C to 85 °C for reliable operation in commercial environments.
- Regulatory Compliance: RoHS compliance supports environmentally conscious design and procurement requirements.
Why Choose XC3S50A-5TQG144C?
The XC3S50A-5TQG144C delivers a compact Spartan®-3A FPGA option that balances logic resources, embedded memory, and I/O capacity in a 144-pin surface-mount package. Its specification set — including 1,584 logic elements, 55,296 bits of on-chip RAM, 108 I/Os, and a 1.14 V–1.26 V core supply — makes it suitable for commercial designs that require moderate programmable logic density in a standard TQFP/LQFP form factor.
This device is a practical choice for engineers and procurement teams seeking a programmable IC that aligns with commercial temperature and RoHS requirements while offering a known gate and resource count for predictable integration into system designs.
Request a quote or submit an inquiry today to get pricing and availability for the XC3S50A-5TQG144C.

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