XC3S50AN-4FT256C

The XC3S50AN-4FT256C is a Spartan®-3AN Field Programmable Gate Array (FPGA) from AMD provided in a 256-LBGA package. It offers a compact, surface-mount FPGA solution combining programmable logic, on-chip RAM, and a broad I/O count for a range of commercial embedded designs.

With a defined logic capacity, on-chip memory and a substantial number of I/O pins, this device is suited for designs that require configurable logic resources in a small-footprint, commercial-temperature device.

Key Features

• Logic Capacity — 176 configurable logic blocks (CLBs) delivering 1,584 logic elements suitable for implementing custom digital logic functions.
• On-Chip Memory — 55,296 bits of embedded RAM for buffering, small FIFOs, and local data storage (approximately 0.055 Mbits).
• I/O — 195 user I/O pins to support multiple external interfaces and peripherals.
• Gate Equivalent — Approximately 50,000 gates of logic complexity for medium-scale programmable designs.
• Power — Core supply range from 1.14 V to 1.26 V, enabling defined power planning for system designers.
• Package and Mounting — 256-LBGA / 256-FTBGA (17×17) package in a surface-mount form factor for compact PCB layouts.
• Operating Range — Commercial-grade operation from 0 °C to 85 °C.
• Environmental Compliance — RoHS-compliant to meet lead-free assembly requirements.

Typical Applications

• General-purpose programmable logic — Implement custom digital functions and glue logic where configurable resources and on-board RAM are required.
• Prototype and development platforms — Use the device’s logic capacity and abundant I/O for evaluating and iterating embedded digital designs.
• I/O expansion and interface bridging — Leverage the 195 I/O pins to connect multiple peripherals and bridge differing interface standards within a compact package.

Unique Advantages

• Compact LBGA packaging: 256-LBGA / 256-FTBGA (17×17) enables high-density placement on space-constrained PCBs.
• Balanced logic and memory: 1,584 logic elements combined with 55,296 bits of on-chip RAM provide a practical mix for many mid-sized digital functions.
• High I/O count: 195 I/O pins simplify integration with external devices and reduce the need for additional interface components.
• Defined power envelope: Core voltage range of 1.14 V to 1.26 V supports predictable power budgeting and supply design.
• Commercial temperature grade: Rated for 0 °C to 85 °C operation to match a wide range of commercial applications.
• RoHS compliant: Supports lead-free manufacturing and regulatory requirements for many markets.

Why Choose XC3S50AN-4FT256C?

The XC3S50AN-4FT256C positions itself as a compact, commercial-grade FPGA option that balances programmable logic, on-chip RAM and a high I/O count in a 256-LBGA surface-mount package. Its defined core voltage range and RoHS compliance make it straightforward to integrate into commercial embedded systems where predictable electrical and environmental characteristics are important.

This device is ideal for engineers and teams needing a mid-scale, configurable logic device for prototyping, interface control, or modular programmable functions—offering clear resource metrics for BOM planning and system integration.

Request a quote or submit a purchase inquiry to get pricing and availability details for the XC3S50AN-4FT256C. Our team can help with lead times and order placement for your project needs.