XC3S50AN-4FTG256I

The XC3S50AN-4FTG256I is a Spartan®-3AN field programmable gate array (FPGA) in a 256-LBGA package. It provides a compact, industrial-grade programmable logic solution with defined on-chip memory, I/O count, and power requirements for designs requiring moderate logic density.

Key silicon characteristics include 1,584 logic elements, approximately 55,296 bits of embedded RAM, and 195 general-purpose I/O, making it suitable for applications that need programmable logic, embedded memory, and a substantial I/O footprint within an industrial temperature range.

Key Features

• Core Logic 1,584 logic elements and an estimated 50,000 gates provide the device's programmable logic capacity for implementing custom digital functions.
• Embedded Memory Approximately 0.055 Mbits (55,296 bits) of on-chip RAM for buffers, state storage, or small data structures.
• I/O Resources 195 I/O pins to support multiple external interfaces and signal connections directly from the FPGA package.
• Power Operates from a core supply range of 1.14 V to 1.26 V, enabling stable operation within the specified supply window.
• Package & Mounting 256-LBGA package (supplier package 256-FTBGA, 17×17) with surface-mount mounting for compact PCB integration.
• Temperature & Grade Industrial grade device rated for an operating temperature range of −40 °C to 100 °C.
• Environmental Compliance RoHS compliant.

Typical Applications

• Industrial Control — Industrial-grade temperature range and logic resources support control and monitoring functions in factory and process environments.
• Embedded Systems — Programmable logic and on-chip RAM allow implementation of custom logic and small data handling within embedded controllers and modules.
• Interface Bridging — The 195 I/O pins enable bridging and signal adaptation between multiple peripherals and subsystems.
• Prototyping and Mid-density Designs — With ~1,584 logic elements and ~50,000 gates, the device is appropriate for prototyping and designs that require moderate gate counts.

Unique Advantages

• Right-sized Logic Density: 1,584 logic elements and ~50,000 gates provide a clear target for mid-density programmable designs without unnecessary overhead.
• On-chip RAM Availability: Approximately 55,296 bits of embedded memory support state machines, FIFOs, and buffering needs directly on the FPGA.
• Generous I/O Count: 195 I/O pins enable multiple parallel interfaces and flexible board-level connections.
• Industrial-Grade Operation: Rated for −40 °C to 100 °C, supporting deployments that require extended ambient temperature ranges.
• Compact BGA Packaging: 256-LBGA / 256-FTBGA (17×17) surface-mount package allows high-density board integration and predictable mechanical form factor.
• RoHS Compliant: Meets environmental requirements for lead-free assembly processes.

Why Choose XC3S50AN-4FTG256I?

The XC3S50AN-4FTG256I positions itself as a compact, industrial-grade Spartan®-3AN FPGA option that balances programmable logic capacity, on-chip memory, and extensive I/O in a 256-LBGA footprint. Its defined supply voltage window and industrial temperature rating provide a predictable platform for engineers targeting mid-density FPGA implementations.

This device is suited for design teams and procurement looking for a scalable, supportable FPGA building block with measurable on-chip resources and environmental compliance for long-term deployment in industrial and embedded applications.

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