XC3S50AN-4TQG144C

The XC3S50AN-4TQG144C is a Spartan®-3AN field programmable gate array (FPGA) manufactured by AMD, delivered in a 144-LQFP surface-mount package. It provides a compact, commercial-grade programmable logic solution with defined on-chip memory, I/O capacity and a specified operating voltage and temperature range.

This device targets commercial applications that require moderate logic density and flexible I/O, offering a combination of 1,584 logic elements, approximately 55 kbits of embedded memory, and 108 I/O pins in a 144-pin LQFP footprint.

Key Features

• Logic Capacity  1,584 logic elements to implement custom digital logic and control functions.
• Embedded Memory  Approximately 55 kbits (55,296 bits) of on-chip RAM for small buffers, state machines and lookup tables.
• I/O Resources  108 user I/O pins to support a variety of peripheral interfaces and board-level connections.
• Device Scale  Listed gate count of 50,000, reflecting the device's overall logic complexity allocation.
• Package and Mounting  144-LQFP / 144-TQFP (20×20) surface-mount package provides high pin count in a compact footprint for PCB designs.
• Power and Temperature  Core supply voltage range of 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C, suitable for commercial-grade environments.
• Compliance  RoHS compliant, meeting common requirements for lead-free assembly.

Typical Applications

• Commercial Embedded Systems  Implement control logic and glue functions where moderate logic density and on-chip RAM are required.
• Interface and I/O Bridging  Provide programmable I/O handling and protocol adaptation using the device's 108 available I/O pins.
• Prototyping and Development  Suitable for development platforms and prototypes that benefit from a compact 144-LQFP package and reusable programmable logic.

Unique Advantages

• Compact, high-pin-count package: The 144-LQFP (144-TQFP 20×20) package delivers substantial I/O capacity in a space-efficient surface-mount footprint.
• Balanced logic and memory: 1,584 logic elements paired with approximately 55 kbits of embedded RAM supports a range of mid-density logic designs without external memory for small data storage needs.
• Defined operating window: The specified core voltage range (1.14–1.26 V) and commercial temperature rating (0 °C to 85 °C) allow predictable integration into commercial products.
• RoHS compliant: Meets lead-free assembly requirements for modern manufacturing workflows.
• Broad I/O flexibility: 108 I/O pins enable diverse peripheral connectivity and board-level interfacing options.

Why Choose XC3S50AN-4TQG144C?

The XC3S50AN-4TQG144C positions itself as a practical, commercial-grade FPGA option for designs that need a balance of programmable logic, on-chip RAM and significant I/O capacity within a compact 144-pin LQFP package. Its defined electrical and thermal parameters make integration and qualification straightforward for commercial product development.

This device is well suited to customers building mid-density programmable logic functions, I/O bridging, or prototype systems where packaging, RoHS compliance, and predictable supply and temperature specifications are important. The combination of logic elements, embedded memory and I/O gives designers a flexible building block for many commercial applications.

If you need pricing, availability or to request a quote for the XC3S50AN-4TQG144C, submit an inquiry to receive more information and a formal quote.