XC3S50AN-4FT256I

The XC3S50AN-4FT256I is a Spartan®-3AN Field Programmable Gate Array (FPGA) in a 256-LBGA package designed for industrial-grade applications. It provides a balance of programmable logic and on-chip memory with 1,584 logic elements and approximately 0.055 Mbits of embedded memory (55,296 bits), alongside 195 general-purpose I/O pins.

Key device characteristics include a core operating voltage range of 1.14 V to 1.26 V, an operating temperature range of -40°C to 100°C, and a compact 256-FTBGA (17×17) footprint for surface-mount integration.

Key Features

• Core & Logic 1,584 logic elements and 176 CLBs provide programmable logic resources suitable for modest complexity designs; approximately 50,000 equivalent gates are available for implementation.
• Embedded Memory Approximately 0.055 Mbits of on-chip RAM (55,296 bits) supports storage for buffers, state machines, and small data sets within the FPGA fabric.
• I/O Capacity 195 I/O pins enable broad connectivity for interfacing with peripherals, sensors, and other digital components.
• Power Core voltage supply range of 1.14 V to 1.26 V for integration into low-voltage system domains.
• Package & Mounting 256-LBGA / 256-FTBGA (17×17) package, surface-mount mounting type, supporting compact board-level implementation.
• Temperature & Grade Industrial grade with an operating temperature range of -40°C to 100°C for deployment in extended-temperature environments.
• Compliance RoHS compliant, simplifying regulatory handling for lead-free assemblies.

Typical Applications

• Prototyping & Development — Use the device for proof-of-concept designs and small-scale FPGA implementations that require up to 1,584 logic elements and on-chip RAM.
• Embedded Logic Acceleration — Offload specific control or data-path functions into programmable logic to complement microcontrollers or DSPs, taking advantage of the device’s logic and I/O resources.
• Interface Bridging & Glue Logic — Implement protocol adaptation, bus interfacing, and signal conditioning using the 195 available I/Os for flexible board-level connectivity.
• Industrial Control — Deploy in equipment and systems that require industrial-grade components and an extended operating temperature range.

Unique Advantages

• Balanced Logic and Memory: 1,584 logic elements paired with ~0.055 Mbits of embedded RAM provide the right mix for control logic, state machines, and modest buffering needs.
• High I/O Count: 195 I/Os enable dense external interfacing without additional bridge devices, reducing BOM complexity.
• Industrial Temperature Range: Rated from -40°C to 100°C for applications requiring extended-temperature operation.
• Compact BGA Footprint: 256-FTBGA (17×17) package supports space-constrained board designs while maintaining thermal and mechanical stability.
• Low-Voltage Core: Operates at a 1.14 V–1.26 V core range, simplifying integration with modern low-voltage power rails.
• RoHS Compliance: Lead-free manufacturing compatibility for regulatory and environmental requirements.

Why Choose XC3S50AN-4FT256I?

The XC3S50AN-4FT256I is positioned for designs that require a compact, industrial-grade FPGA with a balanced complement of logic, memory, and I/O. Its combination of 1,584 logic elements, approximately 55,296 bits of embedded RAM, and 195 I/Os makes it suitable for control, interfacing, and modest acceleration tasks where board space and extended temperature capability matter.

Designed for engineers and procurement teams seeking a reliable programmable solution, this device delivers predictable electrical and thermal characteristics, streamlined system integration via a 256-LBGA package, and RoHS compliance for modern assembly processes.

Request a quote or submit a quote inquiry for pricing and availability of the XC3S50AN-4FT256I to receive detailed procurement information and lead-time options.