XC3S50AN-4TQ144I

The XC3S50AN-4TQ144I is a Spartan®-3AN FPGA in a 144-LQFP surface-mount package, offering a balance of logic capacity, on-chip memory, and I/O resources for embedded and industrial designs. It is provided in an industrial-grade device with a specified operating temperature range and low-voltage core supply.

This device targets applications that require moderate logic density, dedicated on-chip RAM, and a compact package with significant I/O count for interface and control tasks.

Key Features

• Core & Logic  1,584 logic elements organized across 176 configurable logic blocks (CLBs) to implement combinational and sequential logic functions for custom designs.
• On-Chip Memory  Total embedded memory of 55,296 bits (approximately 0.055 Mbits) for buffering, small FIFOs, and local storage.
• I/O Resources  108 user I/O pins to support multiple interfaces and external peripherals in a single-chip solution.
• Performance Density  Equivalent to 50,000 gates, enabling integration of moderate-complexity logic networks and glue logic.
• Power  Core voltage supply range from 1.14 V to 1.26 V to match low-voltage system domains.
• Package & Mounting  144-LQFP (supplier package referenced as 144-TQFP, 20×20) in a surface-mount form factor for compact PCB layouts.
• Industrial Operating Range  Rated for -40 °C to 100 °C operation and designated as Industrial grade for temperature-sensitive deployments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial control  Use the industrial temperature rating and logic resources for control logic, timing, and interface tasks in automation equipment.
• Embedded systems  Implement custom peripheral controllers and glue logic where moderate logic density and on-chip RAM are required.
• I/O aggregation and bridging  Leverage 108 user I/Os to consolidate multiple external signals and implement protocol translation or signal conditioning.

Unique Advantages

• Moderate logic capacity: 1,584 logic elements and 176 CLBs provide enough programmable fabric for medium-complexity designs without excess cost or footprint.
• On-chip memory for local buffering: 55,296 bits of embedded RAM enable small data buffering and state storage without external memory components.
• High I/O count in a compact package: 108 I/Os in a 144-LQFP surface-mount package simplify board-level routing and keep the BOM compact.
• Industrial temperature tolerance: Specified -40 °C to 100 °C operation supports deployment in temperature-challenging environments.
• Low-voltage core: 1.14–1.26 V supply allows integration into low-voltage system power rails.
• RoHS compliant: Environmental compliance for regulated markets and manufacturing processes.

Why Choose XC3S50AN-4TQ144I?

The XC3S50AN-4TQ144I delivers a practical balance of programmable logic, embedded memory, and I/O capacity in a compact 144-LQFP surface-mount package, all within an industrial-grade temperature specification. It is suited for engineers seeking a cost-effective FPGA for moderate-complexity designs that require reliable operation across extended temperature ranges.

This part is appropriate for teams building embedded controllers, I/O bridges, and industrial control subsystems that benefit from integrated logic and on-chip RAM, compact PCB footprint, and RoHS compliance.

Request a quote or submit a procurement inquiry for the XC3S50AN-4TQ144I to receive pricing and availability information tailored to your project needs.