XC3S50AN-4TQG144I

The XC3S50AN-4TQG144I is a Spartan®-3AN Field Programmable Gate Array (FPGA) from AMD in a 144-LQFP surface-mount package. It provides 1,584 logic elements, 55,296 bits of on-chip RAM and 108 user I/O pins for implementing custom digital logic and interfaces.

Specified for industrial use, this device operates over a −40 °C to 100 °C range, supports a core supply of 1.14 V to 1.26 V, and is RoHS compliant—suitable where programmable logic and industrial temperature capability are required.

Key Features

• Core Logic  Approximately 1,584 logic elements and about 50,000 gates for implementing custom combinational and sequential logic.
• Embedded Memory  55,296 bits of on-chip RAM available for data storage, buffering and state machines.
• I/O Density  108 user I/O pins to connect peripherals, sensors and external logic.
• Power  Operates from a specified supply voltage range of 1.14 V to 1.26 V.
• Package & Mounting  Surface-mount 144-LQFP package (supplier package: 144-TQFP, 20 × 20 mm) for compact board-level integration.
• Temperature & Grade  Industrial-grade device with an operating temperature range of −40 °C to 100 °C.
• Compliance  RoHS compliant for environmental and regulatory conformance.

Typical Applications

• Industrial Control  Implement custom control logic and interface aggregation in industrial systems that require an extended operating temperature range.
• Embedded Systems  Add programmable logic and peripheral interfacing in compact, surface-mount designs using the 144-LQFP package.
• Prototyping and Proof-of-Concept  Leverage the available logic elements and on-chip RAM for early architecture exploration and validation.

Unique Advantages

• Balanced Logic and I/O  1,584 logic elements combined with 108 I/Os enable moderately complex designs without a large-package footprint.
• On-Chip Memory  55,296 bits of embedded RAM provide local storage for buffering, FIFOs and small data structures, reducing external memory requirements.
• Industrial Temperature Range  Rated from −40 °C to 100 °C to meet many industrial environmental requirements.
• Compact Surface-Mount Package  144-LQFP (20 × 20 mm supplier outline) simplifies board layout for space-constrained applications.
• Compliance-Minded  RoHS compliance supports environmentally conscious manufacturing and deployment.

Why Choose XC3S50AN-4TQG144I?

The XC3S50AN-4TQG144I delivers a practical mix of logic capacity, embedded RAM and I/O in a compact, surface-mount 144-LQFP package. Its industrial temperature rating and RoHS compliance make it well suited for embedded and industrial applications that require configurable logic within a controlled power envelope (1.14 V–1.26 V).

Backed by AMD manufacturing, this Spartan®-3AN device is appropriate for designers seeking a reliable, package-ready FPGA option for prototypes, embedded controllers and moderate-density programmable logic needs.

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