XC3S700A-4FG400C

The XC3S700A-4FG400C is a Spartan®-3A field programmable gate array (FPGA) offered in a 400-ball BGA package. It delivers a configurable logic fabric with 13,248 logic elements, approximately 0.369 Mbits of on-chip RAM, and up to 311 user I/O pins for designs requiring moderate logic density and flexible I/O.

Targeted for commercial-grade applications, the device operates from a 1.14 V to 1.26 V supply and is specified for 0 °C to 85 °C operation, packaged for surface-mount assembly and compliant with RoHS requirements.

Key Features

• Core Logic  13,248 logic elements provide a programmable fabric suitable for a wide range of custom logic functions and moderate-complexity designs.
• Embedded Memory  Approximately 0.369 Mbits of on-chip RAM supports buffering, lookup tables, and data storage for implemented logic.
• I/O Capacity  Up to 311 user I/O pins enable extensive interfacing options for peripherals, sensors, and external devices.
• Gate Count  Approximately 700,000 gates to express combinational and sequential logic resources in your design.
• Power Supply  Operates from a core supply range of 1.14 V to 1.26 V, matching low-voltage system domains.
• Package & Mounting  Supplied in a 400-BGA (400-FBGA, 21×21) surface-mount package for high-density PCB integration.
• Temperature & Grade  Commercial grade device specified for 0 °C to 85 °C ambient operation.
• Environmental Compliance  RoHS-compliant construction supports regulatory and manufacturing requirements.

Typical Applications

• Custom Logic and Prototyping  Implement and iterate application-specific logic functions where reconfigurability and moderate logic density are required.
• Embedded Systems  Integrate custom control, protocol handling, or glue logic into commercial embedded products leveraging the available logic and I/O resources.
• Communications and Interfaces  Use the device to implement interface bridging, protocol conversion, and I/O aggregation with ample user I/O and on-chip memory.
• Consumer and Commercial Electronics  Deploy in commercial electronic products that require configurable hardware acceleration or customized peripheral control within the specified temperature range.

Unique Advantages

• Moderate Logic Density: 13,248 logic elements allow designers to implement sizeable custom logic without moving to larger device families.
• Integrated On-Chip Memory: Approximately 0.369 Mbits of embedded RAM reduces dependence on external memory for many buffering and lookup tasks.
• High I/O Count: 311 user I/O pins provide flexibility to connect multiple peripherals and interfaces directly to the FPGA fabric.
• Compact, Surface-Mount Package: The 400-BGA (21×21) package supports compact PCB layouts while maintaining strong electrical performance.
• Commercial Temperature and RoHS Compliance: Specified 0 °C to 85 °C operation and RoHS compliance simplify integration into standard commercial products and manufacturing flows.

Why Choose XC3S700A-4FG400C?

The XC3S700A-4FG400C positions itself as a versatile, commercially graded FPGA solution for designs that require a balance of logic capacity, embedded memory, and substantial I/O. Its 13,248 logic elements and approximately 0.369 Mbits of on-chip RAM support a broad set of configurable hardware tasks while the 400-BGA package enables dense PCB implementations.

This device suits engineering teams designing commercial embedded systems, communications interfaces, and custom logic solutions who need a reprogrammable platform with defined power and temperature characteristics, a high I/O count, and RoHS compliance.

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