XC3S700A-4FG484C

The XC3S700A-4FG484C is a Spartan‑3A field programmable gate array manufactured by AMD. It delivers a programmable logic fabric with 13,248 logic elements, approximately 0.369 Mbits of embedded memory, and a large I/O count for complex digital designs.

This commercial‑grade, surface‑mount FPGA is offered in a 484‑ball BGA package and operates from a core supply range of 1.14 V to 1.26 V with an operating temperature range of 0 °C to 85 °C, making it suitable for general-purpose embedded and digital logic applications that require significant gate and I/O density.

Key Features

• Core Logic — 13,248 logic elements provide the programmable fabric for implementing custom digital logic and state machines.
• Embedded Memory — Approximately 0.369 Mbits of on‑chip RAM (368,640 bits) for data buffering, FIFOs, and small LUT‑based memories.
• I/O Capacity — 372 general‑purpose I/O pins to interface with peripherals, buses, and external devices.
• Gate Count — Approximately 700,000 logic gates to support moderate to complex logic implementations.
• Power — Core supply voltage range from 1.14 V to 1.26 V to match system power requirements.
• Package & Mounting — 484‑BBGA package; supplier device package listed as 484‑FBGA (23×23). Surface‑mount mounting type for compact PCB integration.
• Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Custom Digital Logic — Implement user‑defined state machines, data path logic, and control functions using 13,248 logic elements.
• I/O‑Intensive Interfaces — Support external peripherals and parallel interfaces with 372 I/O pins for flexible connectivity.
• Embedded Memory Utilization — Use approximately 0.369 Mbits of embedded RAM for buffering, small lookup tables, and temporary storage.
• Moderate‑Complexity Gate Implementations — Leverage an approximate 700,000‑gate capacity for designs that require substantial logic resources without high‑end device complexity.

Unique Advantages

• Balanced Logic Capacity: 13,248 logic elements combined with ~700,000 gates delivers a practical balance between resource density and design complexity.
• Significant I/O Count: 372 I/O pins reduce the need for external I/O expanders and simplify board‑level interconnects.
• On‑Chip Memory: Approximately 0.369 Mbits of embedded RAM supports local buffering and data staging without external memory.
• Compact BGA Packaging: 484‑ball BGA (supplier: 484‑FBGA 23×23) enables high‑density PCB layouts in space‑constrained systems.
• Low‑Voltage Core: Narrow core voltage range (1.14 V–1.26 V) assists in power budgeting and integration with modern power rails.
• Regulatory Compliance: RoHS compliance supports environmental requirements for many assembly processes.

Why Choose XC3S700A-4FG484C?

The XC3S700A-4FG484C positions itself as a commercial‑grade Spartan‑3A FPGA option that combines a substantial logic element count, embedded RAM, and high I/O density in a compact BGA package. Its specified core voltage and operating temperature range make it suitable for general embedded digital designs that need moderate to significant programmable resources.

This device is appropriate for engineers seeking a balanced FPGA solution from AMD for designs that prioritize a combination of logic capacity, on‑chip memory, and strong I/O availability while maintaining RoHS compliance and surface‑mount packaging.

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