XC3S700A-4FG400I

The XC3S700A-4FG400I is a Spartan®-3A field programmable gate array (FPGA) IC manufactured by AMD. It provides a configurable digital logic fabric with on-chip memory and extensive I/O for embedded and industrial applications.

Key characteristics include 13,248 logic elements, approximately 0.369 Mbits of embedded RAM, 311 user I/Os, and a 400-ball BGA package. The device is specified for industrial operation from −40°C to 100°C and operates from a 1.14 V to 1.26 V supply.

Key Features

• Programmable Logic Capacity 13,248 logic elements organized across 1,472 CLBs provide the base for implementing custom digital functions.
• Embedded Memory Approximately 0.369 Mbits of on-chip RAM (368,640 total bits) for buffering, FIFOs, and state storage.
• I/O Resources 311 user I/Os support connectivity and interfacing with external peripherals and signals.
• Gate Equivalent 700,000-gate capacity for expressing complex designs within the FPGA fabric.
• Power Supported core voltage range of 1.14 V to 1.26 V for the FPGA core supply domain.
• Package and Mounting 400-BGA package (400-FBGA, 21×21) in a surface-mount form factor for compact board-level integration.
• Industrial Temperature and Compliance Industrial grade device rated for −40°C to 100°C and RoHS compliant.

Typical Applications

• Industrial Control — Industrial-grade temperature rating and configurable logic make this FPGA suitable for automation and control system logic functions.
• I/O-Intensive Designs — With 311 user I/Os, the device fits applications requiring extensive external signal interfacing and aggregation.
• Embedded Digital Processing — The combination of 13,248 logic elements and on-chip RAM supports custom data-paths, protocol handling, and finite-state logic.
• Board-Level Integration — The 400-FBGA (21×21) package and surface-mount mounting support compact PCB implementations.

Unique Advantages

• High logic density: 13,248 logic elements and 1,472 CLBs enable implementation of substantial custom logic without external ASICs.
• Substantial on-chip memory: Approximately 0.369 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Ample I/O availability: 311 user I/Os simplify interfacing with sensors, buses, and peripherals, reducing the need for external multiplexing logic.
• Industrial robustness: Specified for −40°C to 100°C operation and classified as industrial grade to meet extended-environment requirements.
• Compact, production-ready package: 400-FBGA (21×21) surface-mount package supports high-density PCB layouts and automated assembly.
• Clearly defined supply range: 1.14 V to 1.26 V core voltage specification helps with power-supply planning and system design.

Why Choose XC3S700A-4FG400I?

The XC3S700A-4FG400I positions itself as a versatile FPGA for designs that require significant logic capacity, embedded memory, and broad I/O connectivity in an industrial-grade package. Its combination of 13,248 logic elements, roughly 0.369 Mbits of on-chip RAM, and 311 I/Os provides a balanced platform for custom digital functions and board-level integration.

This AMD-manufactured Spartan®-3A device is suitable for engineering teams looking for a compact, surface-mount FPGA solution that meets industrial temperature requirements and RoHS compliance while offering a clear set of specifications for power, I/O, and logic resources.

Request a quote or contact sales to discuss availability, pricing, and lead times for the XC3S700A-4FG400I.