XC3S50AN-5FTG256C

The XC3S50AN-5FTG256C is a Spartan®-3AN field programmable gate array (FPGA) provided in a 256-LBGA package. It combines a mid-range logic fabric with on-chip RAM and a substantial I/O count for configurable digital designs operating on a low-voltage supply.

With 176 CLBs (1,584 logic elements), approximately 55,296 bits of embedded RAM, and 195 user I/Os, this commercial-grade FPGA targets applications that require flexible programmable logic, moderate embedded memory, and compact packaging within a 0 °C to 85 °C operating range.

Key Features

• Core Logic  176 CLBs providing 1,584 logic elements and an approximate 50,000-gate equivalent capacity for implementing custom digital functions.
• Embedded Memory  Approximately 55,296 bits of on-chip RAM to support data buffering, small lookup tables, and state storage without external memory.
• I/O Resources  195 user I/Os to support wide connectivity and interface requirements in compact system designs.
• Package and Mounting  256-LBGA (256-FTBGA 17×17) package optimized for surface-mount assembly and space-constrained PCBs.
• Power  Operates from a 1.14 V to 1.26 V supply range to match low-voltage system power rails.
• Operating Range  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance  RoHS-compliant material set for regulatory alignment in standard commercial applications.

Typical Applications

• Embedded Systems  Implement custom control logic and peripheral interfacing using the device's CLBs, on-chip RAM, and extensive I/O.
• Prototyping and Development  Use the FPGA’s programmable fabric and moderate resource set to validate digital designs and iterate hardware logic quickly.
• Custom I/O Interfaces  Leverage 195 I/Os to create tailored interface bridges, signal aggregation, or protocol conversion for compact systems.

Unique Advantages

• Balanced Logic Density: 176 CLBs and 1,584 logic elements provide a middle-ground resource set for many programmable logic tasks without over-provisioning.
• On-Chip Memory: Approximately 55,296 bits of embedded RAM reduce dependence on external memory for small buffers and control state.
• High I/O Count: 195 user I/Os enable flexible connectivity options for multi-signal and multi-interface designs.
• Compact Packaging: 256-LBGA (17×17 FTBGA) minimizes PCB footprint for space-constrained applications while supporting surface-mount assembly.
• Low-Voltage Operation: 1.14 V to 1.26 V supply range aligns with modern low-voltage digital systems.
• Commercial Temperature Grade: Rated for 0 °C to 85 °C operation for standard commercial environments.

Why Choose XC3S50AN-5FTG256C?

The XC3S50AN-5FTG256C positions itself as a practical choice when designers need a compact, low-voltage FPGA with balanced logic capacity, embedded memory, and a high I/O count. Its 256-LBGA footprint and surface-mount mounting make it suitable for space-limited PCBs while supporting a wide range of configurable digital tasks.

This FPGA is well suited for teams and projects that require a commercial-grade programmable device offering moderate gate density, on-chip RAM, and extensive I/O without moving to larger device families.

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