XC3S50AN-5TQG144C

The XC3S50AN-5TQG144C is a Spartan®-3AN field programmable gate array (FPGA) in a compact 144-pin LQFP package. It provides a balance of logic capacity, on-chip memory and I/O count for designs requiring moderate logic density and a low-voltage core.

Key device attributes include 1,584 logic elements (176 CLBs), approximately 55 Kbits of embedded RAM, up to 108 I/O pins, a 50,000-gate equivalent density, a 1.14 V–1.26 V supply range and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• Core / Architecture  Spartan®-3AN FPGA architecture in a compact package supporting a 1.14 V to 1.26 V core supply range.
• Logic Capacity  Approximately 1,584 logic elements (176 CLBs) and a gate-equivalent count of 50,000 to implement moderate-density digital designs.
• On-chip Memory  Approximately 55 Kbits (55,296 bits) of embedded RAM for local buffering, state storage and small data tables.
• I/O  Up to 108 general-purpose I/O pins to support multiple interfaces and external peripherals.
• Package & Mounting  144-pin LQFP package; supplier reference also lists a 144-TQFP (20×20) variant. Surface-mount mounting type suited for board-level assembly.
• Power & Temperature  Low-voltage core operation (1.14 V–1.26 V) and commercial-grade operating temperature range of 0 °C to 85 °C.
• Regulatory / Environmental  RoHS compliant for lead-free manufacturing and environmental conformity.

Typical Applications

• Moderate-density digital logic  Designs that require around 1,584 logic elements and a 50,000-gate equivalent for glue logic, control sequencing or protocol handling.
• I/O-centric interfacing  Applications that need up to 108 I/O pins in a compact 144-LQFP footprint for connecting peripherals, sensors or external controllers.
• Embedded memory dependent functions  Use cases that leverage approximately 55 Kbits of on-chip RAM for small FIFOs, lookup tables or local buffering.
• Low-voltage FPGA implementations  Systems designed around a 1.14 V–1.26 V core supply where low-voltage operation is a design requirement.

Unique Advantages

• Compact package with substantial I/O: The 144-pin LQFP package delivers up to 108 I/Os, enabling densely packed board designs without sacrificing connectivity.
• Balanced logic and memory: 1,584 logic elements combined with ~55 Kbits of embedded RAM supports a wide range of control, interfacing and data buffering tasks within a single device.
• Low-voltage operation: Core supply range of 1.14 V–1.26 V aligns with low-voltage system power rails and helps reduce overall power draw in compatible designs.
• Commercial temperature range: Rated 0 °C to 85 °C for standard commercial applications and environments.
• RoHS compliant: Supports lead-free manufacturing flows and regulatory requirements for many markets.

Why Choose XC3S50AN-5TQG144C?

The XC3S50AN-5TQG144C places Spartan®-3AN FPGA capability into a compact 144-LQFP package, offering a practical mix of logic elements, embedded RAM and I/O for moderate-density designs. Its low-voltage core and commercial temperature rating make it suitable for board-level solutions where footprint, connectivity and on-chip resources matter.

This device is well suited to engineers and procurement teams looking for an FPGA that provides balanced integration and predictable specifications—including explicit counts for logic elements, RAM bits, I/O and package—backed by the AMD product lineage.

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