XC3S700A-4FG484I

The XC3S700A-4FG484I is a Spartan®-3A Field Programmable Gate Array (FPGA) offered in a 484-ball BGA package for surface-mount applications. It provides a balanced mix of programmable logic, I/O capacity and on-chip memory for embedded logic integration in industrial designs.

With 13,248 logic elements, approximately 0.37 Mbits of embedded memory and up to 372 I/O pins, this device supports mid-range FPGA tasks where integration, I/O count and industrial temperature operation are required. It operates from a core supply of 1.14 V to 1.26 V and is rated for -40 °C to 100 °C.

Key Features

• Programmable Logic — 13,248 logic elements provide a substantial resource pool for implementing custom logic, state machines and glue logic.
• Embedded Memory — Approximately 0.37 Mbits of on-chip RAM to support FIFOs, buffering and small data stores without external memory.
• I/O Capacity — 372 general-purpose I/O pins enable high pin-count designs and extensive peripheral interfacing.
• Gate Count — Approximately 700,000 gates for broad logic synthesis and integration of multiple functions on a single IC.
• Power — Core voltage supply range from 1.14 V to 1.26 V to match system power-domain requirements.
• Package & Mounting — Supplied in a 484-BBGA package; supplier device package listed as 484-FBGA (23 × 23); surface-mount mounting type for compact board designs.
• Industrial Temperature Range — Rated for operation from -40 °C to 100 °C, suitable for a wide range of industrial environments.
• RoHS Compliant — Meets RoHS requirements for lead-free manufacturing processes.

Typical Applications

• Industrial Control — Implement deterministic control logic, sensor aggregation and I/O handling using the device’s logic resources and high I/O count.
• Embedded System Glue Logic — Consolidate discrete logic, bus interfacing and protocol adaptation to reduce board-level component count.
• Signal Processing Blocks — Use on-chip RAM and logic elements for buffering, filtering and custom processing pipelines in mid-range applications.
• Prototyping and Development — Suitable for FPGA-based prototyping where a balance of logic, memory and I/O is needed in an industrial-temperature package.

Unique Advantages

• Balanced Resource Profile: 13,248 logic elements and approximately 0.37 Mbits of embedded memory provide ample capacity for integrated mid-range designs.
• High I/O Count: 372 I/O pins support complex interfacing requirements and multiple peripheral connections without external expanders.
• Industrial Reliability: Rated for -40 °C to 100 °C operation, enabling deployment in demanding thermal environments.
• Compact Packaging: 484-BBGA (supplier listed as 484-FBGA 23×23) surface-mount package helps minimize PCB area while maintaining high pin density.
• Design Consolidation: Nearly 700,000 gates allow integration of multiple functions on a single FPGA, reducing BOM and interconnect complexity.
• Compliance: RoHS-compliant construction supports modern manufacturing and environmental requirements.

Why Choose XC3S700A-4FG484I?

The XC3S700A-4FG484I positions itself as a mid-range Spartan®-3A FPGA that combines a robust logic element count, useful on-chip memory and a high I/O complement in an industrial-temperature, surface-mount BGA package. It is suited to engineers seeking to consolidate functionality, reduce component count and support demanding operating temperatures.

Its mixture of logic, embedded RAM and I/O density makes it a practical choice for industrial control, embedded system integration and prototyping projects where long-term reliability and component-level integration are priorities.

Request a quote or submit an inquiry to receive pricing and availability for the XC3S700A-4FG484I and to discuss how this FPGA can fit into your next design.