XC3S700A-4FGG484I

The XC3S700A-4FGG484I is a Spartan®-3A Field Programmable Gate Array (FPGA) IC manufactured by AMD. It provides 13,248 logic elements organized across 1,472 CLBs and on-chip memory totaling 368,640 bits (approximately 0.37 Mbits) for embedded logic and buffering.

Engineered for industrial-grade applications, this device offers 372 user I/O pins and approximately 700,000 gates. It operates from a 1.14 V to 1.26 V supply, supports an ambient range of –40 °C to 100 °C, and is supplied in a 484-BBGA (manufacturer package: 484-FBGA, 23×23) surface-mount package. The device is RoHS compliant.

Key Features

• Core Logic 13,248 logic elements across 1,472 CLBs and an approximate 700,000-gate implementation capacity for complex digital designs.
• Embedded Memory 368,640 bits of on-chip RAM (approximately 0.37 Mbits) for data storage, FIFOs, and buffering without external memory.
• I/O Density 372 user I/O pins to support extensive peripheral and interface connectivity directly from the device.
• Power Operates from a core voltage supply range of 1.14 V to 1.26 V, enabling defined power budgeting at system level.
• Temperature and Grade Industrial-grade qualification with an operating temperature range of –40 °C to 100 °C for demanding environmental conditions.
• Package and Mounting Available in a 484-BBGA package (supplier device package: 484-FBGA, 23×23) designed for surface-mount assembly.
• Compliance RoHS compliant for environmental and regulatory considerations in manufacturing.

Unique Advantages

• Substantial logic capacity: 13,248 logic elements and 1,472 CLBs enable implementation of sizable custom logic functions without immediate need for larger FPGA families.
• On-chip memory for system integration: Approximately 0.37 Mbits of embedded RAM reduces reliance on external memory for many buffering and state-storage tasks.
• High I/O count: 372 I/O pins permit direct interfacing to a wide range of peripherals and sensors, simplifying board-level routing.
• Industrial temperature range: Rated from –40 °C to 100 °C to support deployment in harsh or outdoor industrial environments.
• Compact, surface-mount package: The 484-BBGA / 484-FBGA (23×23) package balances board area efficiency with high pin count for dense designs.
• Defined power envelope: 1.14 V–1.26 V core supply range assists predictable power design and thermal planning.

Why Choose XC3S700A-4FGG484I?

The XC3S700A-4FGG484I is positioned for engineers seeking a robust, industrial-grade FPGA with a balanced combination of logic density, on-chip memory, and high I/O capacity. Its specified operating voltage and wide temperature range make it suitable for designs that demand reliable operation across challenging environments.

As an AMD-manufactured Spartan®-3A device, it delivers a practical platform for embedded logic, interface consolidation, and system-level integration where on-chip resources and industrial-grade operation are required.

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