XC3S700A-5FGG400C

The XC3S700A-5FGG400C is a Spartan®-3A Field Programmable Gate Array (FPGA) IC from AMD provided in a 400‑ball BGA package. It delivers 13,248 logic elements, approximately 0.369 Mbits of embedded memory, and up to 311 user I/Os in a surface-mount 400‑FBGA (21×21) package.

Designed for commercial-grade applications, the device operates from 1.14 V to 1.26 V and across a 0 °C to 85 °C ambient range, offering a balance of integration and predictable electrical characteristics for board-level digital logic designs.

Key Features

• Core Logic — 13,248 logic elements providing substantial programmable logic capacity for custom digital functions and glue logic.
• On-chip Memory — Approximately 0.369 Mbits of embedded RAM to support buffering, small FIFOs, and local data storage without external memory.
• I/O Density — 311 user I/Os to support a wide range of parallel interfaces and board-level signal routing.
• Gate Count — 700,000 gates enabling complex combinational and sequential logic implementations.
• Package & Mounting — 400‑BGA (supplier device package: 400‑FBGA, 21×21) in a surface-mount form factor for high-density PCB designs.
• Power — Operates from 1.14 V to 1.26 V, allowing designers to plan power distribution and sequencing around a defined core-voltage window.
• Temperature & Grade — Commercial grade device specified for 0 °C to 85 °C operation.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• Custom digital logic — Implement board-level glue logic, protocol translation, and combinational/sequential functions leveraging 13,248 logic elements and 311 I/Os.
• Embedded buffering and small-data storage — Use the embedded RAM (~0.369 Mbits) for FIFOs, small frame buffers, or local data staging.
• Prototyping and development — Evaluate and iterate digital designs on a commercially graded FPGA platform with broad I/O and gate resources.

Unique Advantages

• High logic capacity: 13,248 logic elements and 700,000 gates enable implementation of substantial custom logic without immediate need for external ASICs.
• Integrated memory: Approximately 0.369 Mbits of on-chip RAM reduces dependence on external memory for small buffering and control tasks, simplifying PCB routing.
• Extensive I/O: 311 user I/Os provide flexibility for interfacing multiple peripherals and signals directly to the FPGA.
• Compact, board-friendly package: 400‑FBGA (21×21) surface-mount package supports high-density PCB layouts while maintaining robust signal count.
• Defined operating window: 1.14 V to 1.26 V supply range and commercial 0 °C to 85 °C rating enable predictable system power and thermal planning.
• RoHS compliant: Meets RoHS requirements for environmentally conscious design and manufacturing.

Why Choose XC3S700A-5FGG400C?

The XC3S700A-5FGG400C positions itself as a balanced, commercially graded FPGA solution offering a substantial mix of logic, memory, and I/O in a compact 400‑BGA package. Its combination of 13,248 logic elements, approximately 0.369 Mbits of embedded RAM, and 311 I/Os makes it suitable for designers who need significant programmable resources without moving to larger, higher-cost devices.

Backed by AMD’s Spartan®‑3A family pedigree, this device supports scalable designs that can be replicated across production volumes where commercial-grade temperature and RoHS compliance are required. It is a practical choice for development teams and OEMs seeking integration density, predictable electrical characteristics, and on-chip resources to streamline board-level digital designs.

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