XC3S700AN-4FG484C

The XC3S700AN-4FG484C is a Spartan®-3AN field programmable gate array (FPGA) from AMD, delivered in a 484-ball BGA package. Built for commercial applications, it provides a balance of programmable logic, on-chip memory and high I/O density for custom digital designs and embedded systems.

Its architecture supports moderate logic complexity with a low-voltage core supply and surface-mount packaging, making it suitable for compact boards that require flexible hardware implementation and integration.

Key Features

• Logic Capacity  13,248 logic elements for implementing custom combinational and sequential logic.
• Configurable Logic Blocks (CLBs)  1,472 CLBs provide structured resources for mapping logic functions and control logic.
• Embedded Memory  Approximately 0.37 Mbits of embedded memory (368,640 bits) for buffering, FIFOs and small data stores.
• I/O Density  372 user I/O pins to interface with peripherals, sensors and external buses.
• Gate Count  700,000 gates enabling medium-complexity system designs.
• Power  Core voltage supply range of 1.14 V to 1.26 V to match target system power constraints.
• Package & Mounting  484-ball BGA (supplier package listed as 484-FBGA, 23×23) in a surface-mount form factor for compact PCB integration.
• Operating Range  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Regulatory  RoHS-compliant material status for environmental compliance in commercial assemblies.

Typical Applications

• Embedded Control  Use in control logic and glue-logic roles where 13,248 logic elements and on-chip memory enable custom state machines and peripheral interfacing.
• Signal Processing  Implement deterministic, low-latency processing tasks that benefit from FPGA parallelism and local embedded memory.
• High-Density I/O Systems  Suitable for designs requiring many external connections—372 I/Os support interfacing to sensors, displays and communication ports.

Unique Advantages

• Balanced Logic and Memory:  13,248 logic elements combined with ~0.37 Mbits of embedded memory support mid-range designs without external memory for small buffers.
• High I/O Count:  372 I/Os reduce the need for external multiplexing or additional interface chips, simplifying board-level design.
• Compact Packaging:  484-ball BGA in a 23×23 footprint enables high-density PCB layouts while maintaining surface-mount manufacturability.
• Low-Voltage Core:  Narrow core supply window (1.14–1.26 V) aids in stable power delivery and predictable thermal behavior within commercial operating conditions.
• RoHS Compliant:  Conforms to RoHS requirements for restricted substances in commercial electronic assemblies.

Why Choose XC3S700AN-4FG484C?

The XC3S700AN-4FG484C offers a practical combination of logic density, embedded memory and extensive I/O in a commercial-grade FPGA from AMD. Its specifications make it well suited to engineers building embedded controllers, mid-range signal processing blocks or I/O-heavy interfaces where a compact surface-mount solution is required.

Choose this device when you need a proven FPGA footprint with clear electrical and thermal operating bounds, straightforward integration into surface-mount workflows, and sufficient on-chip resources to reduce external component count and simplify system design.

Request a quote or submit an inquiry for XC3S700AN-4FG484C to receive pricing and availability information tailored to your production needs.