XC3S700A-4FTG256I

The XC3S700A-4FTG256I is a Spartan®-3A family FPGA IC designed for industrial applications. It provides a balanced combination of logic capacity, on-chip memory, and I/O density for mid-range programmable logic designs.

With 13,248 logic elements, approximately 0.37 Mbits of embedded memory, 161 I/Os and a 256-LBGA package, this device targets industrial systems that require reliable, reprogrammable logic with wide operating temperature support and compact surface-mount packaging.

Key Features

• Core Logic — 1,472 configurable logic blocks (CLBs) aggregating to 13,248 logic elements for implementing custom digital functions.
• Embedded Memory — Total on-chip RAM of 368,640 bits, approximately 0.37 Mbits of embedded memory for data buffering, FIFOs and small LUT-based storage.
• I/O Density — 161 user I/Os to support multiple peripheral interfaces and board-level integration.
• Gate Count — Approximately 700,000 gates enabling moderate-complexity system integration in a single device.
• Power — Core supply range from 1.14 V to 1.26 V to support system power planning and voltage regulation design.
• Package & Mounting — 256-LBGA (supplier package: 256-FTBGA, 17×17) in a surface-mount form factor for compact PCB layouts.
• Industrial Temperature Range — Specified operating range from −40 °C to 100 °C for use in industrial environments.
• RoHS Compliant — Conforms to RoHS requirements for environmental compliance.

Typical Applications

• Industrial Control — Suitable for control logic, sequencing and supervisory functions that require industrial temperature operation between −40 °C and 100 °C.
• Embedded Processing — Implement custom accelerators, protocol handlers or glue logic using 13,248 logic elements and on-chip RAM.
• Interface Bridging — 161 I/Os enable board-level interfacing and signal aggregation for mixed-signal and digital peripheral connectivity.

Unique Advantages

• Balanced Logic Capacity: 13,248 logic elements provide headroom for moderate-complexity designs without excessive BOM changes.
• On‑Chip Memory for Local Storage: Approximately 0.37 Mbits of embedded RAM supports buffering and low-latency data handling within the FPGA fabric.
• Industrial-Grade Operation: Rated for −40 °C to 100 °C, enabling deployment in a wide range of industrial environments.
• High I/O Count: 161 I/Os simplify integration with multiple peripherals and system interfaces, reducing external glue logic.
• Compact Surface-Mount Package: 256-LBGA (256-FTBGA, 17×17) offers a small PCB footprint for space-constrained designs.

Why Choose XC3S700A-4FTG256I?

The XC3S700A-4FTG256I positions itself as a dependable mid-range FPGA option for industrial applications that need flexible programmable logic, embedded memory, and solid I/O capacity in a compact surface-mount package. Its combination of 13,248 logic elements, approximately 0.37 Mbits of on-chip RAM, and 161 I/Os makes it well suited to engineers designing control systems, protocol bridges, and embedded accelerators where industrial temperature performance and RoHS compliance are required.

Designed for teams that value integration and predictable long-term deployment, this Spartan®-3A device supports scaling of logic functions within a robust, industry-focused footprint backed by established FPGA design flows.

Request a quote or submit your design inquiry today to get pricing and availability for the XC3S700A-4FTG256I.