XC3S700A-4FT256I

The XC3S700A-4FT256I is a Spartan®-3A Field Programmable Gate Array (FPGA) provided in a 256-LBGA package. It delivers a combination of programmable logic capacity, on-chip memory, and a substantial I/O count suitable for a wide range of digital logic implementations.

Key architectural attributes include approximately 13248 logic elements, 368640 bits of embedded memory, and 161 user I/Os, with industrial-grade temperature tolerance and a narrow core supply range for consistent operation.

Key Features

• Programmable Logic Capacity  Approximately 13,248 logic elements provide the configurable logic resources needed for custom digital designs and logic-intensive functions.
• Embedded Memory  Approximately 368,640 bits of on-chip RAM enable local buffering, state storage, and simple data processing without external memory.
• I/O Count  161 general-purpose I/Os support interfacing with peripherals, sensors, and external devices for flexible system integration.
• Gate Density  Approximately 700,000 gates for implementing complex combinational and sequential logic networks.
• Power  Specified core voltage supply range of 1.14 V to 1.26 V for the FPGA core.
• Package & Mounting  256-LBGA (supplier device package: 256-FTBGA 17×17) in a surface-mount form factor for board-level integration.
• Operating Range & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for reliable operation in demanding environments.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Used for programmable logic tasks, I/O aggregation, and control logic where industrial temperature range and robust packaging are required.
• Communications and Networking  Implements custom protocol handling, data buffering, and interface logic leveraging its logic capacity and on-chip RAM.
• Prototyping and Custom Logic  Suitable for development boards and prototype systems that require reprogrammable logic, significant gate density, and a high I/O count.

Unique Advantages

• Balanced Logic and Memory:  Combines approximately 13,248 logic elements with about 368,640 bits of embedded RAM to support both control and data-path functions on-chip.
• Substantial I/O Resources:  161 user I/Os simplify external interfacing and reduce the need for additional I/O expanders in many designs.
• Industrial Reliability:  Rated for −40 °C to 100 °C operation and supplied in a robust 256-LBGA package appropriate for industrial environments.
• Compact Surface-Mount Package:  256-FTBGA (17×17) package provides a high-density solution for space-constrained PCBs.
• Controlled Core Supply:  Operation within a defined 1.14 V to 1.26 V supply range supports predictable power design and integration with regulated power systems.
• RoHS Compliant:  Meets RoHS requirements for lead-free assembly processes.

Why Choose XC3S700A-4FT256I?

The XC3S700A-4FT256I positions itself as a versatile Spartan®-3A FPGA option that brings together a meaningful mix of logic, embedded memory, and I/O resources in an industrial-grade, surface-mount package. Its specification set is well suited to designers who need on-chip capacity for custom digital logic, reliable operation across an extended temperature range, and straightforward board-level integration.

Choose this device when your design requires a reprogrammable logic device with substantial gate and memory resources, a defined core voltage range, and industrial temperature tolerance for long-term deployment in fielded equipment or demanding environments.

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