XC3S700A-4FTG256C

The XC3S700A-4FTG256C is a Spartan®-3A Field Programmable Gate Array (FPGA) manufactured by AMD. It provides a balanced combination of logic density, on-chip memory, and I/O for mid-range programmable logic integration.

With 1,472 CLBs (approximately 13,248 logic elements), about 368,640 bits of embedded RAM (approximately 0.37 Mbits), and 161 I/O pins, this device is suited to designs that require moderate logic capacity, on-chip memory, and a compact BGA package for surface-mount assembly.

Key Features

• Core Logic Density 1,472 CLBs delivering approximately 13,248 logic elements to implement combinational and sequential logic functions for mid-range FPGA designs.
• Embedded Memory Approximately 368,640 bits of on-chip RAM (roughly 0.37 Mbits) to support data buffering, small FIFOs, and local storage without external memory.
• I/O Capability 161 user I/O pins to interface with peripherals, sensors, and external devices for flexible system integration.
• Package and Mounting 256-LBGA package (supplier package: 256-FTBGA, 17 × 17) with surface-mount mounting for compact board-level integration.
• Power Operates from a core voltage supply range of 1.14 V to 1.26 V, enabling low-voltage core operation suitable for modern power domains.
• Operating Range Commercial-grade temperature range of 0 °C to 85 °C for standard environmental conditions.
• Regulatory RoHS compliant to support environmentally conscious designs and manufacturing processes.

Typical Applications

• Embedded Control Implement control logic and state machines where moderate logic density and on-chip memory enable integration of application-specific functionality.
• Interface and Glue Logic Bridge and adapt signals between peripherals or microcontrollers using the device’s plentiful I/O count and programmable logic.
• Prototyping and Development Rapidly prototype algorithms and custom logic blocks leveraging the array of CLBs and local RAM for functional validation.
• Signal Processing Implement modest signal-processing pipelines and data buffering using the available logic elements and embedded memory.

Unique Advantages

• Balanced Logic Capacity: 1,472 CLBs and ~13,248 logic elements provide the right scale for mid-range FPGA tasks without unnecessary overhead.
• On-Chip Memory: Approximately 0.37 Mbits of embedded RAM reduces dependence on external memory for small buffers and FIFOs, simplifying board design.
• High I/O Count: 161 I/O pins enable flexible interfacing to a wide range of peripherals and external devices, minimizing additional I/O expanders.
• Compact BGA Package: 256-LBGA (256-FTBGA, 17 × 17) offers a small PCB footprint for space-constrained applications while supporting surface-mount assembly.
• Low-Voltage Core: Narrow core supply range (1.14 V–1.26 V) helps align with modern low-voltage power domains and simplifies power supply design.
• RoHS Compliant: Meets RoHS requirements for environmentally conscious manufacturing and regulatory compliance.

Why Choose XC3S700A-4FTG256C?

The XC3S700A-4FTG256C positions itself as a practical choice for designers seeking a mid-range FPGA that combines substantial programmable logic, embedded RAM, and a high I/O count in a compact BGA package. Its commercial temperature rating and RoHS compliance make it suitable for standard electronics and embedded applications.

This device is well suited to teams and projects that need to consolidate discrete logic, implement interface logic, or prototype custom accelerators while keeping board area and component count under control. The combination of CLBs, on-chip RAM, and 161 I/O pins delivers integration and flexibility for a variety of system designs.

If you would like pricing, lead-time, or availability information for the XC3S700A-4FTG256C, submit a request for a quote or an RFQ and our team will respond with the details you need.