XC3S700A-5FTG256C

The XC3S700A-5FTG256C is a Spartan®-3A Field Programmable Gate Array (FPGA) from AMD, provided in a 256-LBGA package for surface-mount assembly. It delivers a balanced combination of programmable logic, embedded memory, and I/O density for commercial-grade designs.

With 13,248 logic elements, approximately 0.369 Mbits of on-chip RAM and 161 I/O pins, this device is suited to commercial applications requiring moderate logic capacity, on-chip storage and flexible interfacing, while operating within a 1.14–1.26 V supply range and 0 °C to 85 °C temperature window.

Key Features

• Logic Capacity  13,248 logic elements provide the programmable fabric to implement custom digital functions and glue logic.
• Embedded Memory  Approximately 0.369 Mbits of on-chip RAM (368,640 bits) for data buffering, small FIFOs or state storage without external memory.
• I/O Resources  161 user I/O pins support a wide range of external interfaces and signal connections.
• Gate Equivalency  Approximately 700,000 gates of logic equivalent, useful for estimating overall design scale.
• Power Supply  Operates from a core voltage range of 1.14 V to 1.26 V, enabling controlled power budgeting at system level.
• Package and Mounting  256-LBGA (supplier device package: 256-FTBGA, 17×17) for compact, surface-mount integration on modern PCBs.
• Operating Range  Commercial-grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance  RoHS compliant for global manufacturing requirements.

Typical Applications

• Custom digital logic  Implement glue logic, protocol bridging or custom state machines using the device’s 13,248 logic elements and embedded RAM.
• Embedded control for commercial equipment  Integrate control functions and moderate buffering on-chip for compact commercial-grade products operating within 0 °C to 85 °C.
• Prototyping and FPGA-based development  Use the device’s programmable fabric and available I/O to validate digital designs prior to production.
• I/O-intensive interfaces  Leverage 161 I/O pins to connect multiple peripherals, sensors or interface buses without immediate need for external multiplexing.

Unique Advantages

• Balanced logic and memory  13,248 logic elements paired with ~0.369 Mbits of on-chip RAM enable designs that need both programmable logic and local storage without added external components.
• Flexible connectivity  161 I/O pins provide broad interfacing capability to support a variety of peripheral and bus connections.
• Compact surface-mount package  256-LBGA (17×17 FTBGA) allows high-density board integration while keeping PCB footprint constrained.
• Commercial-grade operating range  Rated 0 °C to 85 °C to match typical commercial product environments and deployment scenarios.
• Regulatory-friendly  RoHS compliance supports environmentally conscious manufacturing and distribution requirements.

Why Choose XC3S700A-5FTG256C?

The XC3S700A-5FTG256C positions itself as a commercially graded Spartan-3A FPGA that combines moderate logic density, embedded memory and substantial I/O in a compact 256-LBGA package. Its electrical and thermal specifications—1.14 V to 1.26 V supply range and 0 °C to 85 °C operating temperature—make it suitable for a wide range of commercial electronic designs that require reliable programmable logic and local storage.

This device is a practical option for developers and procurement teams designing mid-scale digital systems, providing a clear balance of integration, interfacing capability and regulatory compliance while simplifying PCB-level integration with a surface-mount LBGA package.

Request a quote or submit an inquiry to receive pricing and availability for the XC3S700A-5FTG256C. Our team will respond with ordering and lead-time information to support your design schedule.