XC3S700AN-4FG484I

The XC3S700AN-4FG484I is a Spartan®-3AN field programmable gate array (FPGA) manufactured by AMD. It provides programmable logic resources, embedded memory and a high I/O count in a compact surface-mount BGA package for industrial applications.

This device targets designs that require moderate logic capacity, on-chip RAM, and large I/O connectivity within an industrial temperature range, while operating from a low-voltage core supply.

Key Features

• Logic Capacity — 13,248 logic elements available for implementing custom digital logic and control functions.
• Embedded Memory — Approximately 0.37 Mbits (368,640 bits) of on-chip RAM for buffers, lookup tables and state storage.
• I/O Resources — 372 user I/O pins to support multiple interfaces and peripheral connections.
• Logic Scale — Approximately 700,000 gates for implementing medium-complexity designs.
• Power — Core voltage supply range of 1.14 V to 1.26 V to match system power-rail requirements.
• Package & Mounting — Surface-mount 484-BBGA package; supplier device package listed as 484-FBGA (23x23) for board-level integration.
• Temperature Range — Industrial operating temperature from −40 °C to 100 °C for deployment in temperature-challenging environments.
• RoHS Compliance — Device is RoHS compliant to support environmental requirements.

Typical Applications

• Industrial Control and Automation — Implement custom control logic and I/O interfacing in environments that require industrial temperature performance.
• Custom Digital and Prototyping — Development of custom digital circuits and functional prototypes leveraging 13,248 logic elements and embedded RAM.
• High-Density I/O Systems — Systems that need large numbers of general-purpose I/Os for sensor, actuator or peripheral interfacing.
• Memory-Buffered Logic — Designs that require on-chip RAM for buffering, small data queues or lookup storage.

Unique Advantages

• Significant Logic Resource: 13,248 logic elements provide room for medium-complexity designs without external logic expansion.
• On-Chip Memory: Approximately 0.37 Mbits of embedded RAM reduces the need for external memory for many control and buffering tasks.
• High I/O Count: 372 I/Os simplify board-level routing for multi-interface designs and reduce the need for external multiplexing.
• Industrial-Grade Operation: −40 °C to 100 °C operating range supports deployment in industrial environments.
• Low-Voltage Core: 1.14 V to 1.26 V supply range helps align with modern low-voltage power domains.
• Compact BGA Package: 484-BBGA / 484-FBGA (23x23) packaging enables high-density board layouts in a surface-mount form factor.

Why Choose XC3S700AN-4FG484I?

The XC3S700AN-4FG484I combines a balanced set of logic elements, embedded memory and a large I/O complement in an industrial-grade FPGA package from AMD. Its mix of resources and operating range make it well suited for industrial control, custom digital designs and I/O-heavy applications where board space and reliable temperature performance are important.

Choosing this device provides a compact, RoHS-compliant programmable logic solution with clear, verifiable specifications for logic capacity, memory, I/O and thermal operation, allowing designers and procurement teams to evaluate fit for target systems with confidence.

Request a quote or submit an inquiry to obtain pricing and availability for the XC3S700AN-4FG484I.