XC3S700AN-4FGG484I

The XC3S700AN-4FGG484I is a Spartan®-3AN Field Programmable Gate Array (FPGA) from AMD, offering a balance of programmable logic, I/O capacity, and on-chip memory in a compact 484-ball BGA package. It provides designers with deterministic, reconfigurable hardware resources for embedded logic implementations.

With 1,472 configurable logic blocks totaling 13,248 logic elements, approximately 0.37 Mbits of embedded memory, and 372 user I/O, this device targets applications that require moderate logic density, multiple I/O channels, and reliable operation across an industrial temperature range.

Key Features

• Core Logic  13,248 logic elements organized across 1,472 configurable logic blocks (CLBs) and approximately 700,000 gates for implementing custom logic and control functions.
• Embedded Memory  Total on-chip RAM of 368,640 bits — approximately 0.37 Mbits — suitable for buffering, small lookup tables, and local data storage.
• I/O Capacity  372 user I/O pins to support multiple parallel interfaces, sensor arrays, and system control lines.
• Package & Mounting  484-ball BGA package (484-FBGA, 23 × 23) designed for surface-mount assembly to conserve board area while providing robust connectivity.
• Power  Operating core supply voltage range from 1.14 V to 1.26 V to meet specified power and logic-level requirements.
• Temperature & Grade  Industrial-grade device specified for operation from −40 °C to 100 °C, suitable for harsh environments where extended temperature range is required.
• Compliance  RoHS-compliant construction supporting lead-free manufacturing processes.

Typical Applications

• Embedded Control and Processing  Use the device to implement custom control logic and state machines where the combination of 13,248 logic elements and on-chip RAM delivers compact deterministic processing.
• Multi‑I/O Interface Aggregation  The 372 user I/O pins make this FPGA suitable for aggregating sensors, peripherals, and parallel interfaces on compact boards.
• Industrial Automation  The industrial temperature rating (−40 °C to 100 °C) and surface-mount BGA packaging support deployment in factory-floor and embedded industrial systems.

Unique Advantages

• High Logic Density: 13,248 logic elements and ~700K gates enable implementation of substantial custom logic while minimizing external components.
• Integrated On‑Chip Memory: Approximately 0.37 Mbits of embedded RAM reduce dependence on external memory for many buffering and LUT needs.
• Extensive I/O: 372 I/O pins provide flexibility for multi-channel interfacing and parallel signal handling without complex multiplexing.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to support reliable operation in temperature-sensitive or harsh environments.
• Compact, Surface‑Mount Package: 484-ball FBGA (23 × 23) package conserves PCB area while delivering a robust connection footprint for surface-mount assembly.
• RoHS Compliance: Environmentally compliant materials and processes facilitate integration into lead-free manufacturing flows.

Why Choose XC3S700AN-4FGG484I?

The XC3S700AN-4FGG484I positions itself as a versatile, industrial-grade FPGA that combines a substantial logic fabric with meaningful on-chip memory and a large I/O count in a compact BGA package. Its specified voltage range and operating temperature make it suitable for embedded and industrial systems that require reliable, reconfigurable hardware.

Designed for engineers who need balanced logic capacity, multiple interfaces, and rugged operation, this AMD Spartan®-3AN device provides measurable integration that can simplify board-level design, reduce bill of materials, and support long-term deployment in controlled and harsh environments.

Request a quote or submit an inquiry today to obtain pricing and availability for the XC3S700AN-4FGG484I and to discuss how this FPGA can fit your next design.