XC3SD1800A-4CSG484C

The XC3SD1800A-4CSG484C is an AMD Spartan®-3A DSP field programmable gate array (FPGA) in a 484-ball CSPBGA/FBGA package. It integrates a substantial array of programmable logic and on-chip RAM to support DSP-oriented and general-purpose programmable logic tasks.

With a commercial operating temperature range and RoHS compliance, this device is suited for designs that require dense logic, embedded memory, and a large number of I/O in a surface-mount 484-CSPBGA (19×19) footprint.

Key Features

• Logic Capacity — Approximately 37,440 logic elements organized across 4,160 logic blocks, enabling complex logic and custom datapath implementations.
• Embedded Memory — Approximately 1.55 Mbits of on-chip RAM for buffering, lookup tables, and local storage for signal processing and control functions.
• I/O Resources — 309 user I/O pins to support multiple interfaces, parallel connections, and board-level I/O requirements.
• Gate Count — 1,800,000 gates of programmable logic capacity for scalable implementation of algorithms and state machines.
• Power — Core supply voltage range of 1.14 V to 1.26 V, supporting standard low-voltage FPGA core operation.
• Package & Mounting — 484-ball FBGA/CSPBGA package (484-CSPBGA, 19×19) designed for surface-mount PCB assembly.
• Operating Conditions — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Regulatory — RoHS compliant.

Typical Applications

• DSP and Signal Processing — On-chip memory and dense logic element count support implementation of digital signal processing algorithms and hardware acceleration.
• Custom Logic and Control — Implement complex state machines, protocol handlers, and custom control logic using the available logic resources and I/O.
• I/O-Intensive Interfaces — Large number of I/O pins enables board-level bridging, parallel data capture, and multi-channel interfacing.

Unique Advantages

• High Logic Density: Approximately 37,440 logic elements and 1.8M gates provide capacity for substantial custom logic and DSP implementation without external ASICs.
• On-Chip Memory: ~1.55 Mbits of embedded RAM reduces dependence on external memory for buffering and local data storage.
• Extensive I/O: 309 I/O pins give designers flexibility for interfacing multiple peripherals and high-pin-count connectors.
• Compact Packaging: 484-CSPBGA (19×19) package delivers a high pin count in a compact surface-mount form factor for space-constrained PCBs.
• Commercial Readiness: RoHS compliance and a 0 °C to 85 °C rating align the device with standard commercial electronic product requirements.

Why Choose XC3SD1800A-4CSG484C?

The XC3SD1800A-4CSG484C provides a balanced combination of programmable logic, embedded memory, and abundant I/O in a compact 484-ball package. Its DSP-focused Spartan®-3A architecture and sizable logic/memory resources make it suitable for designs that require on-chip acceleration and flexible hardware customization.

This device is well suited to engineers and teams building commercial-grade FPGA solutions that need scalable logic capacity, substantial on-chip RAM, and many I/O without moving to a larger package or external accelerators.

Request a quote or submit an inquiry to receive pricing and availability information for the XC3SD1800A-4CSG484C and to discuss how it fits your project requirements.