XC3SD1800A-4FG676I

The XC3SD1800A-4FG676I is a Spartan®-3A DSP field programmable gate array (FPGA) in a 676‑ball BGA package from AMD. It combines a high count of configurable logic resources with substantial on-chip memory and a large I/O complement for DSP-focused programmable hardware designs.

This industrial‑grade, surface‑mount device operates across a wide temperature range and a low-voltage core supply, making it suitable for systems that require dense logic capacity, embedded memory, and extensive I/O connectivity.

Key Features

• Logic Capacity — 4,160 configurable logic blocks (CLBs) and 37,440 logic elements, supporting complex custom logic implementations.
• On‑chip Memory — Approximately 1.55 Mbits of embedded memory (total RAM bits: 1,548,288) for buffering, FIFOs, and local data storage.
• Gate Count — Approximately 1,800,000 gates for broad functional integration.
• I/O Density — 519 I/O pins to support high‑connectivity designs and multiple parallel interfaces.
• Power — Core voltage supply range from 1.14 V to 1.26 V to match low‑voltage system architectures.
• Package & Mounting — 676‑FBGA (27×27) package in a surface‑mount form factor (676‑BGA).
• Temperature Range — Industrial operating temperature from −40 °C to 100 °C for deployment in demanding environments.
• Compliance — RoHS compliant.

Typical Applications

• Digital Signal Processing — DSP‑oriented FPGA fabric and substantial on‑chip memory make the device suitable for implementing DSP algorithms and pipelines.
• High‑Density I/O Systems — With 519 I/O pins, it supports designs requiring multiple parallel interfaces, sensor arrays, or large pin‑count connectivity.
• Embedded Control and Prototyping — Large logic element and CLB counts enable complex control logic and rapid hardware prototyping for industrial systems.

Unique Advantages

• High logic integration: 37,440 logic elements and 4,160 CLBs provide capacity for substantial custom logic in a single device.
• Significant on‑chip memory: Approximately 1.55 Mbits of embedded RAM supports local buffering and data handling without immediate reliance on external memory.
• Extensive I/O: 519 I/O pins accommodate complex interfacing requirements and parallel connections.
• Industrial temperature capability: Rated −40 °C to 100 °C for use in environments with wide thermal variation.
• Compact BGA package: 676‑FBGA (27×27) surface‑mount package enables high‑density PCB layouts.
• Low‑voltage core operation: 1.14 V to 1.26 V supply range aligns with low‑voltage system architectures.

Why Choose XC3SD1800A-4FG676I?

The XC3SD1800A-4FG676I is positioned for designs that demand a balance of large programmable logic capacity, on‑chip memory, and high I/O density within an industrial‑grade FPGA. Its combination of CLBs, logic elements, and embedded RAM supports complex DSP and control implementations in a single package.

For developers and procurement teams seeking a surface‑mount, RoHS‑compliant FPGA with a 676‑BGA footprint and industrial temperature rating, this device offers a compact, high‑capacity option that aligns with low‑voltage core systems and dense PCB integration requirements.

Request a quote today to check availability and receive pricing and lead‑time information for the XC3SD1800A-4FG676I.