XC3SD1800A-4CSG484LI

The XC3SD1800A-4CSG484LI is a Spartan®-3A DSP field programmable gate array (FPGA) in a 484-CSPBGA (19×19) package. It provides a dense logic fabric and DSP-focused architecture suited for designs that require on-chip processing, flexible I/O, and industrial-grade operating conditions.

With 37,440 logic elements, approximately 1.55 Mbits of embedded memory and 309 I/O pins, this device targets DSP and industrial applications that benefit from a low-voltage core and extended temperature capability.

Key Features

• Logic Capacity  Contains 37,440 logic elements and 4,160 CLB-equivalent resources for implementing complex combinational and sequential logic.
• Embedded Memory  Approximately 1.55 Mbits of on-chip RAM to store intermediate data, buffering and small LUT-based tables for DSP and control tasks.
• DSP-Oriented Architecture  Spartan-3A DSP family device suitable for implementations requiring on-chip arithmetic and signal processing support as indicated by the product series name.
• Rich I/O  309 I/O pins to support wide external interfacing and parallel data paths for sensors, converters, and peripheral devices.
• Compact Package & Mounting  484-CSPBGA (19×19) surface-mount package for high-density board designs while preserving thermal and signal routing benefits.
• Power  Core supply operating range of 1.14 V to 1.26 V to support low-voltage system architectures.
• Industrial Reliability  Industrial grade device rated for an operating temperature range from -40 °C to 100 °C.
• Standards Compliance  RoHS-compliant manufacturing and materials.

Typical Applications

• Digital Signal Processing  Deployable in FPGA-based DSP tasks where on-chip arithmetic, buffering and logic are required for algorithm acceleration.
• Industrial Control Systems  Suitable for control and automation applications that require industrial-grade temperature performance and broad I/O connectivity.
• High-Density I/O Interfacing  Useful for systems needing numerous external connections—data aggregation, protocol bridging or custom peripheral interfaces.

Unique Advantages

• High Logic Integration: 37,440 logic elements enable consolidation of logic, control and processing functions into a single device, reducing board-level component count.
• On-Chip Memory: Approximately 1.55 Mbits of embedded RAM supports data buffering and intermediate storage without external memory.
• Extensive I/O: 309 I/O pins provide flexibility for parallel interfaces, sensor arrays, and peripheral connectivity.
• Industrial Temperature Range: Rated from -40 °C to 100 °C, making it suitable for deployments in harsh or temperature-variable environments.
• Compact, Surface-Mount Package: 484-CSPBGA (19×19) footprint helps optimize PCB real estate in space-constrained designs.
• Low-Voltage Core: Operates from 1.14 V to 1.26 V, aligning with modern low-voltage system power domains.

Why Choose XC3SD1800A-4CSG484LI?

The XC3SD1800A-4CSG484LI combines a DSP-oriented Spartan-3A FPGA architecture with substantial logic density, embedded memory and a high I/O count to address signal processing and control applications that demand integration and reliable operation. Its industrial temperature rating and RoHS compliance make it appropriate for long-life deployments in industrial environments.

This device is well suited to engineers seeking a compact, surface-mount FPGA solution with strong on-chip resources for mid-range DSP and I/O-intensive designs, offering a balance of integration, power efficiency and environmental robustness.

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