XC3SD1800A-4CSG484I

The XC3SD1800A-4CSG484I is a Spartan®-3A DSP field programmable gate array IC designed for applications requiring substantial logic capacity and embedded memory. As an FPGA device with DSP-oriented architecture, it provides a combination of logic elements, on-chip RAM, and high-density I/O for complex digital signal and control tasks.

With 37,440 logic elements, approximately 1.55 Mbits of embedded memory, and 309 I/O pins in a 484-FBGA (19×19) CSPBGA package, this industrial-grade device targets designs that need integration, deterministic operation across a wide temperature range, and surface-mount packaging for compact layouts.

Key Features

• Logic Capacity  37,440 logic elements and approximately 1,800,000 gates provide substantial programmable logic resources for complex digital designs.
• Embedded Memory  Approximately 1.55 Mbits of on-chip RAM to support buffering, state storage, and intermediate data processing without external memory.
• I/O Density  309 user I/O pins enable wide peripheral interfacing, multi-channel data acquisition, and parallel bus connectivity in dense designs.
• Voltage Supply  Operates across a defined core voltage range of 1.14 V to 1.26 V to match system power architectures.
• Package and Mounting  Shipped in a 484-FBGA, CSPBGA package (484-CSPBGA, 19×19) optimized for surface-mount assembly and space-constrained boards.
• Industrial Temperature Range  Rated for operation from –40 °C to 100 °C to meet typical industrial environmental requirements.
• Regulatory  RoHS-compliant construction aligns with common environmental compliance requirements.

Typical Applications

• Signal and DSP Processing  Uses the device’s DSP-oriented architecture and large logic/memory resources for digital filtering, transforms, and real-time data manipulation.
• Industrial Control  Combines wide operating temperature range and high I/O count for motor control, PLC offload functions, and factory automation interfaces.
• High-Density I/O Aggregation  Enables bridging, protocol handling, and parallel data collection where dozens to hundreds of signals must be managed efficiently.

Unique Advantages

• Substantial On-Chip Resources:  37,440 logic elements and approximately 1.55 Mbits of embedded RAM reduce dependence on external components and simplify board-level design.
• High I/O Count:  309 I/O pins facilitate direct interfacing to multiple peripherals and parallel data paths, minimizing external multiplexing.
• Industrial Reliability:  Rated for –40 °C to 100 °C operation and RoHS compliance for use in industrial environments with established environmental requirements.
• Compact Surface-Mount Packaging:  484-FBGA (19×19) CSPBGA package supports high-density PCB layouts while maintaining robust mechanical mounting.
• Defined Power Envelope:  Core voltage range of 1.14 V to 1.26 V supports predictable power design and integration into regulated power domains.

Why Choose XC3SD1800A-4CSG484I?

The XC3SD1800A-4CSG484I positions itself as a high-capacity Spartan®-3A DSP FPGA optimized for designs that require a combination of large programmable logic, significant embedded RAM, and extensive I/O in a compact surface-mount package. Its industrial temperature rating and RoHS compliance make it suitable for long-life, environmentally demanding applications.

This device is well suited to engineering teams building DSP-intensive systems, industrial controllers, and dense I/O aggregation solutions who need a reliable, scalable FPGA platform with clear, verifiable specifications for logic, memory, I/O, power, and thermal performance.

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