XC3SD1800A-4FGG676I

The XC3SD1800A-4FGG676I is a Spartan®-3A DSP field programmable gate array from AMD, designed for DSP-oriented and high-density logic implementations. It delivers a mix of logic capacity, embedded memory and high I/O count suitable for industrial applications that require reconfigurable digital processing within a 676-ball BGA package.

Key Features

• Logic Capacity 37,440 logic elements providing substantial programmable logic resources for complex designs.
• Embedded Memory Approximately 1.55 Mbits of on-chip RAM to support data buffering, FIFOs and local storage for DSP and control functions.
• I/O Density 519 user I/O pins to accommodate wide parallel interfaces, high-speed data paths and extensive peripheral connectivity.
• Gate Count Around 1,800,000 gates of device logic enabling large-scale integration of custom functions and DSP blocks.
• Package and Mounting 676-ball BGA (supplier package: 676-FBGA, 27 × 27 mm) with surface-mount construction for compact board-level integration.
• Power Core voltage supply range of 1.14 V to 1.26 V to match system power-rail planning and regulator selection.
• Industrial Temperature Range Specified for operation from −40 °C to 100 °C to meet temperature demands of industrial environments.
• Compliance RoHS compliant, supporting regulatory requirements for lead-free assembly.

Typical Applications

• Industrial Control and Automation — Leverage the industrial temperature rating and high I/O count for sensor interfacing, motor control logic and machine automation systems.
• Digital Signal Processing — Use the device’s DSP-oriented architecture and on-chip RAM for real-time signal filtering, data acquisition and processing pipelines.
• High-Density Embedded Systems — Integrate complex control and protocol handling in compact designs using the large logic capacity and dense BGA package.

Unique Advantages

• Substantial Logic Resources: 37,440 logic elements enable consolidation of multiple functions on a single FPGA, reducing external component count.
• Significant On-Chip Memory: Approximately 1.55 Mbits of embedded RAM helps minimize external memory requirements for buffering and local data storage.
• Extensive I/O Availability: 519 I/Os provide flexibility for wide buses, parallel peripherals and multiple interface standards without immediate external multiplexing.
• Industrial Reliability: −40 °C to 100 °C operating range and RoHS compliance support deployment in demanding industrial environments.
• Compact Board-Level Integration: 676-FBGA (27×27 mm) package enables high-density placement while maintaining robust soldered connections for long-term reliability.
• Vendor-Backed Component: Manufactured by AMD, providing traceability to a recognized semiconductor supplier.

Why Choose XC3SD1800A-4FGG676I?

The XC3SD1800A-4FGG676I positions itself as a high-capacity Spartan®-3A DSP FPGA that balances logic density, embedded memory and I/O richness within a compact 676-BGA footprint. Its industrial temperature rating and RoHS compliance make it suited for reliable deployment in industrial and DSP-centric systems where integration and robustness matter.

Designers targeting complex digital signal processing, high-density embedded control, or I/O-intensive applications will find the combination of approximately 37,440 logic elements, ~1.55 Mbits of on-chip RAM, and 519 I/Os valuable for consolidating functions and simplifying board-level designs.

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