XC3SD3400A-4CS484I

The XC3SD3400A-4CS484I is a Spartan®-3A DSP field programmable gate array (FPGA) from AMD designed for industrial-grade deployments. This device integrates a substantial array of programmable logic and on-chip memory to support DSP-focused and I/O-intensive designs.

With a large complement of logic resources, approximately 2.32 Mbits of embedded memory and 309 I/O pins in a 484‑FBGA package, the device targets applications that require dense logic, significant on-chip RAM and robust I/O connectivity within a surface-mount, industrial-temperature package.

Key Features

• Logic resources — 5968 logic blocks and 53,712 logic elements provide extensive programmable logic capacity for complex designs.
• Embedded memory — Approximately 2.32 Mbits of on-chip RAM to support buffering, FIFOs and intermediate data storage for DSP and control functions.
• Gate count — Approximately 3.4 million gates enabling mid-density system integration.
• I/O capacity — 309 user I/O pins to accommodate broad peripheral and bus connectivity requirements.
• Supply voltage — Operates from 1.14 V to 1.26 V, enabling compatibility with low-voltage core power domains.
• Package and mounting — 484‑FBGA, CSPBGA (484‑CSPBGA, 19×19) surface-mount package for compact board-level integration.
• Industrial temperature range — Rated for −40 °C to 100 °C to support deployment in demanding environments.
• RoHS compliant — Meets RoHS requirements for lead-free manufacturing processes.

Typical Applications

• DSP and signal processing systems — On-chip memory and dense logic enable implementation of DSP kernels, filters and real-time data paths.
• Industrial control and automation — Industrial temperature rating and abundant I/O make the device suitable for control logic, motor control interfaces and sensor aggregation.
• Communications and networking — High logic capacity and numerous I/Os support protocol processing, framing and interface bridging tasks.
• Embedded prototyping and custom logic — Programmable logic and memory resources provide a flexible platform for design validation and custom peripheral implementation.

Unique Advantages

• Substantial programmable capacity: 53,712 logic elements and ~3.4 million gates allow integration of complex finite-state machines, datapaths and control logic on a single device.
• Significant on-chip memory: Approximately 2.32 Mbits of embedded RAM reduces reliance on external memory for buffering and intermediate storage.
• Robust I/O count: 309 user I/Os simplify board-level interfacing and reduce the need for external I/O expanders.
• Industrial robustness: −40 °C to 100 °C operating range supports deployment in challenging environmental conditions.
• Compact surface-mount package: 484‑FBGA (19×19 CSPBGA) enables high-density PCB layouts while maintaining thermal and signal integrity for complex designs.
• RoHS compliance: Supports lead-free manufacturing and regulatory requirements for many production environments.

Why Choose XC3SD3400A-4CS484I?

The XC3SD3400A-4CS484I combines ample logic resources, a multi-megabit on-chip memory footprint and a high I/O count in a compact 484‑FBGA package rated for industrial temperatures. This balance of capacity, memory and connectivity positions the device for mid-density DSP, control and embedded applications where on-chip resources and rugged operation matter.

Its specifications make it suitable for design teams needing a scalable, programmable building block for DSP-centric projects, industrial controllers and communications interfaces while maintaining compliance with RoHS manufacturing requirements.

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