XC3SD3400A-4CSG484LI

The XC3SD3400A-4CSG484LI is a Spartan®-3A DSP Field Programmable Gate Array (FPGA) from AMD designed for DSP-oriented and high-density logic implementations. This industrial-grade FPGA combines a large logic fabric with significant on-chip memory and a wide I/O count to support compute- and I/O-intensive embedded designs.

With 53,712 logic elements and approximately 2.32 Mbits of embedded memory, the device targets applications that require substantial programmable logic, plentiful I/O, and operation across a broad temperature range.

Key Features

• FPGA Core 53,712 logic elements providing substantial programmable logic capacity and approximately 3.4 million gates for complex digital designs.
• Embedded Memory Approximately 2.32 Mbits of on-chip RAM to support buffering, local storage, and DSP data paths.
• I/O Density 309 user I/O pins to support high pin-count interfaces and multiple parallel buses.
• Package & Mounting Available in a 484-CSPBGA (19x19) / 484-FBGA package; surface-mount mounting type suitable for compact board layouts.
• Power Core supply voltage range of 1.14 V to 1.26 V to match system power requirements.
• Operating Range Industrial operating temperature from −40 °C to 100 °C for demanding environmental conditions.
• Regulatory RoHS compliant.

Typical Applications

• DSP and Signal Processing — Use the Spartan-3A DSP architecture and on-chip RAM for digital filtering, transforms, and other signal-processing tasks.
• Industrial Automation — Industrial-grade temperature range and high logic density enable control, sequencing, and algorithmic tasks in factory and process systems.
• High-Density I/O Systems — 309 I/Os support protocol bridging, parallel interfaces, and multi-channel sensor or actuator connectivity.
• Custom Control and Embedded Logic — Large logic element count and embedded memory allow implementation of custom finite-state machines, control blocks, and data-path acceleration.

Unique Advantages

• High Logic Capacity: 53,712 logic elements enable implementation of sizable custom logic and DSP pipelines without external logic expansion.
• Substantial On-Chip Memory: Approximately 2.32 Mbits of embedded RAM reduces dependence on external memory for buffering and streaming data.
• Extensive I/O: 309 user I/Os accommodate multiple parallel interfaces and dense board-level connectivity.
• Industrial Temperature Support: Rated for −40 °C to 100 °C operation to meet industrial environmental requirements.
• Compact BGA Package: 484-CSPBGA (19x19) footprint provides a space-efficient solution for high-density designs.
• Controlled Core Supply: 1.14 V to 1.26 V supply range supports integration into regulated power domains.

Why Choose XC3SD3400A-4CSG484LI?

The XC3SD3400A-4CSG484LI delivers a balanced combination of programmable logic density, embedded memory, and I/O capacity in an industrial-grade FPGA. It is well suited for engineers designing DSP-focused, I/O-intensive, or industrial control systems that require significant on-chip resources and reliable operation across a wide temperature range.

Built by AMD and offered in a compact 484-CSPBGA package, this device provides a scalable hardware platform for custom logic implementations where integration, deterministic hardware behavior, and robust operating conditions are priorities.

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