XC3SD3400A-4CS484LI

The XC3SD3400A-4CS484LI is a Spartan®-3A DSP field programmable gate array (FPGA) delivered in a 484-ball CSPBGA package. It combines a high count of logic resources, embedded memory, and flexible I/O for signal processing and logic-intensive designs in industrial environments.

This device targets applications that require dense programmable logic, significant on-chip RAM, and a broad I/O complement while operating across a wide supply and temperature range for reliable deployment in industrial systems.

Key Features

• Logic Capacity — 59,68 CLBs and 53,712 logic elements provide substantial programmable fabric for complex logic and control functions.
• Embedded Memory — Approximately 2.322 Mbits of on-chip RAM to support buffering, FIFOs, and DSP data storage without external memory.
• DSP-Oriented Architecture — Spartan®-3A DSP family architecture (as indicated in the product name) suitable for signal processing and arithmetic-intensive blocks.
• I/O Density — 309 user I/O pins to interface with peripherals, sensors, and external logic.
• Device Scale — Approximately 3,400,000 gates to implement large state machines, datapaths, and mixed-control logic.
• Power Supply — Operates from a core voltage range of 1.14 V to 1.26 V, enabling consistent operation within specified supply limits.
• Package — 484-CSPBGA (19×19) surface-mount package for compact board-level integration.
• Temperature Range & Grade — Industrial-grade device rated for operation from −40 °C to 100 °C for robust performance in demanding environments.
• RoHS Compliant — Meets RoHS requirements for lead-free assembly and environmental compliance.

Typical Applications

• Digital Signal Processing — Implement DSP kernels, filters, and arithmetic pipelines using the device’s DSP-oriented architecture and embedded memory.
• Industrial Control — Use for motor control, PLC interfaces, and machine automation where industrial temperature grading and plentiful I/O are required.
• Communications and Data Transport — Suitable for protocol bridging, data aggregation, and interface logic that require many I/Os and on-chip buffering.
• Embedded System Integration — Combine control logic, peripheral interfacing, and data handling in a single programmable device to reduce board-level complexity.

Unique Advantages

• High Logic Density: 53,712 logic elements enable implementation of large finite-state machines and complex control logic without partitioning across multiple devices.
• Significant On-Chip RAM: Approximately 2.322 Mbits of embedded memory reduces dependence on external memory for buffering and local data storage.
• Strong I/O Count: 309 user I/Os support dense peripheral connectivity and high pin-count interfaces directly from the FPGA.
• Industrial Rating: Specified operation from −40 °C to 100 °C supports deployment in temperature-challenging industrial environments.
• Compact Package: 484-CSPBGA (19×19) balances board space efficiency with high I/O and thermal considerations for surface-mount assembly.
• Regulatory Compliance: RoHS compliance facilitates integration into lead-free manufacturing processes and regulatory frameworks.

Why Choose XC3SD3400A-4CS484LI?

The XC3SD3400A-4CS484LI positions itself as a high-capacity Spartan®-3A DSP FPGA that brings together substantial logic resources, embedded RAM, and extensive I/O in a compact CSPBGA package. Its industrial temperature range and RoHS compliance make it suitable for engineered systems that require reliable, long-term operation.

This device is well suited to engineers building DSP-accelerated systems, industrial controllers, and embedded platforms that benefit from on-chip memory and a large programmable fabric. Its combination of capacity and package integration delivers design scalability while simplifying board-level BOM and layout.

Request a quote or submit an inquiry to receive pricing, availability, and support information for the XC3SD3400A-4CS484LI. Our team can help evaluate fit for your design and provide delivery options tailored to your project timeline.