XC3SD3400A-4CSG484I

The XC3SD3400A-4CSG484I is a Spartan®-3A DSP Field Programmable Gate Array from AMD, delivered in a 484‑CSPBGA (19×19) package for surface-mount applications. It combines a large logic fabric with DSP-oriented architecture and substantial on-chip RAM to support logic‑intensive and signal‑processing embedded designs.

With 53,712 logic elements, approximately 2.32 Mbits of embedded memory, 309 I/O, and an industrial operating temperature range (−40 °C to 100 °C), this device is suited to systems that require high logic capacity, dense I/O, and robust temperature tolerance.

Key Features

• Core & Logic  53,712 logic elements provide a high-density programmable fabric for complex digital and DSP functions.
• Embedded Memory  Approximately 2.32 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage for DSP and control tasks.
• I/O Capacity  309 general-purpose I/O pins enable connectivity to multiple peripherals, sensors, and bus interfaces.
• DSP Orientation  Spartan‑3A DSP family designation targets digital signal processing workloads within the FPGA architecture.
• Power  Operates from a supply range of 1.14 V to 1.26 V, allowing predictable integration with system power rails.
• Package  484‑CSPBGA (19×19) surface-mount package suitable for compact board layouts and high-density assemblies.
• Temperature & Grade  Industrial grade with an operating range of −40 °C to 100 °C for deployment in temperature‑stressed environments.
• Standards Compliance  RoHS compliant for regulatory alignment in assemblies requiring restricted substances compliance.

Typical Applications

• DSP and Signal Processing  Implements FPGA-based DSP accelerators and custom signal chains where embedded RAM and logic density are required.
• I/O‑Rich Embedded Systems  Connects multiple sensors, interfaces, and control peripherals using 309 available I/O pins for flexible system integration.
• Industrial Control and Automation  Supports control logic and processing in applications that benefit from industrial temperature qualification (−40 °C to 100 °C).

Unique Advantages

• High Logic Capacity: 53,712 logic elements enable implementation of complex state machines, datapaths, and DSP blocks on a single device, reducing board-level complexity.
• Significant On‑Chip Memory: Approximately 2.32 Mbits of embedded RAM minimizes external memory requirements for buffering and local data processing.
• Extensive I/O Count: 309 I/O pins provide broad interfacing options without additional I/O expanders, simplifying system design.
• Industrial Temperature Range: Rated for −40 °C to 100 °C to meet the needs of temperature-challenging deployment environments.
• Compact, High‑Density Package: 484‑CSPBGA (19×19) package supports dense PCB implementations and surface-mount assembly processes.
• Manufacturer Backing: Supplied by AMD, providing a known vendor source for procurement and lifecycle planning.

Why Choose XC3SD3400A-4CSG484I?

The XC3SD3400A-4CSG484I positions itself as a high-capacity, DSP‑oriented FPGA for embedded systems that need substantial programmable logic, on-chip memory, and large I/O counts within a compact package. Its industrial temperature rating and RoHS compliance make it suitable for applications that require robustness and regulatory alignment.

This device is well suited to engineers and procurement teams designing logic- and signal-processing‑intensive products that prioritize integration density and temperature tolerance, while relying on a known FPGA vendor for sourcing and product continuity.

Request a quote or submit an inquiry for pricing and availability to evaluate the XC3SD3400A-4CSG484I for your next design.