XC3SD3400A-4FG676I

The XC3SD3400A-4FG676I is a Spartan®-3A DSP field programmable gate array (FPGA) from AMD, supplied in a 676-ball BGA package. It combines substantial programmable logic capacity, embedded memory, and a high I/O count in an industrial-grade, surface-mount form factor.

Designed for applications that require DSP-oriented FPGA capability with robust operating range and compact packaging, the device delivers a balance of logic density, on-chip memory, and connectivity for embedded and industrial designs.

Key Features

• Core logic capacity  Approximately 53,712 logic elements and about 3,400,000 gates provide programmable logic density for complex designs.
• Embedded memory  Approximately 2.32 Mbits of on-chip RAM to support data buffering, local storage, and DSP functions.
• I/O resources  469 general-purpose I/O pins to support broad peripheral connectivity and bus interfaces.
• Package and mounting  676-BGA (supplier package: 676-FBGA, 27×27) delivered in a surface-mount footprint for space-constrained PCBs.
• Power  Core voltage supply range of 1.14 V to 1.26 V to match system power domains.
• Operating range  Industrial temperature rating from −40 °C to 100 °C for operation in demanding environments.
• Compliance  RoHS compliant for regulatory and environmental alignment.

Typical Applications

• Digital signal processing  DSP-focused FPGA architecture and on-chip memory support signal filtering, transformation, and acceleration tasks.
• Embedded control systems  High logic density and abundant I/O enable integration of control algorithms and peripheral interfaces on a single device.
• Industrial automation  Industrial temperature range and robust packaging suit control, monitoring, and sensor interfacing in factory and process environments.
• High-density I/O platforms  Large I/O count supports multi-channel data acquisition, communication gateways, and complex bus interconnects.

Unique Advantages

• High logic integration: 53,712 logic elements and 3.4M gates allow implementation of complex processing and control functions without external ASICs.
• On-chip memory capacity: Approximately 2.32 Mbits of embedded RAM reduces the need for external memory in many buffering and DSP use cases.
• Extensive I/O: 469 I/O pins provide flexibility for interfacing with sensors, peripherals, and multiple communication channels.
• Industrial-rated operation: −40 °C to 100 °C temperature range supports deployment in demanding environments.
• Compact BGA packaging: 676-FBGA (27×27) minimizes PCB area while providing a high pin count for dense designs.
• Low-voltage core: 1.14–1.26 V supply range aligns with modern low-voltage system architectures.

Why Choose XC3SD3400A-4FG676I?

This Spartan®-3A DSP FPGA offers a compelling combination of logic density, embedded memory, and I/O capacity in an industrial-grade BGA package. Its specifications make it suitable for engineers building DSP-accelerated embedded systems, industrial controllers, and I/O-intensive platforms that require a single-device solution for logic and interface consolidation.

With RoHS compliance, a defined voltage supply range, and an extended operating temperature window, the XC3SD3400A-4FG676I supports designs that demand reliability and compact integration while maintaining predictable electrical and thermal characteristics.

Request a quote or submit a parts inquiry to get pricing and availability for XC3SD3400A-4FG676I and to discuss how this FPGA fits your next design.