XC3SD3400A-5FGG676C

The XC3SD3400A-5FGG676C is a Spartan®-3A DSP field programmable gate array (FPGA) from AMD, offered in a 676-ball BGA package. This commercial-grade FPGA combines a large logic fabric with substantial embedded memory and a high I/O count to support demanding DSP and custom logic tasks.

With 53,712 logic elements, approximately 2.32 Mbits of on-chip RAM, and 469 I/O pins, the device is suited for I/O-heavy designs requiring significant programmable logic and embedded memory while operating within a 1.14 V to 1.26 V supply range and a 0 °C to 85 °C commercial temperature window.

Key Features

• Logic Capacity 53,712 logic elements provide a dense programmable fabric for implementing complex digital logic and custom data-path functions.
• Embedded Memory Approximately 2.32 Mbits of on-chip RAM to support buffering, FIFOs, and local storage for DSP or control functions.
• DSP-Oriented Architecture Spartan®-3A DSP family architecture optimized for signal processing tasks and arithmetic-heavy logic (product name indicates DSP orientation).
• High I/O Count 469 general-purpose I/O pins to support extensive peripheral interfacing and parallel data streams.
• Gate Density 3,400,000 gates amenable to integrating multiple subsystems and complex control logic into a single device.
• Power Operates from a 1.14 V to 1.26 V supply range to match system power rails and design constraints.
• Package & Mounting 676-ball FBGA (27 × 27 mm) package in a surface-mount form factor for compact board-level integration.
• Commercial Grade & RoHS Compliance Rated for 0 °C to 85 °C operation and RoHS-compliant for standard commercial applications.

Typical Applications

• DSP and Signal Processing Implement digital filters, transforms, and arithmetic-intensive blocks leveraging the device’s DSP orientation and embedded memory.
• I/O-Intensive Systems Use high pin count (469 I/Os) to connect multiple peripherals, sensors, or parallel data busses in communication and control systems.
• High-Density Logic Integration Consolidate multiple control and interface functions into a single FPGA using 53,712 logic elements and 3.4M gates of logic capacity.
• Embedded Memory-Dependent Designs Utilize approximately 2.32 Mbits of on-chip RAM for buffering, packet storage, and local data management without external memory.

Unique Advantages

• Significant Logic Resources: 53,712 logic elements enable implementation of complex custom logic and multiple concurrent functions, reducing the need for discrete ASICs.
• On-Chip Memory for Reduced BOM: Approximately 2.32 Mbits of embedded RAM lowers external memory requirements and simplifies PCB layout.
• Large I/O Footprint: 469 I/Os support extensive peripheral connectivity and parallel interfaces, simplifying system-level integration.
• Compact, Surface-Mount Packaging: 676-FBGA (27 × 27 mm) offers a high-density package suitable for space-constrained PCBs while maintaining robust interconnectivity.
• Commercial Temperature Range: Rated 0 °C to 85 °C for reliable operation in standard commercial environments and applications.
• Regulatory Compliance: RoHS-compliant to meet common environmental and manufacturing requirements.

Why Choose XC3SD3400A-5FGG676C?

The XC3SD3400A-5FGG676C positions itself as a commercially graded, DSP-oriented FPGA that balances substantial logic capacity, embedded memory, and high I/O density in a compact 676-FBGA package. It is well suited for designers who need to consolidate multiple digital functions, accelerate signal-processing tasks, or build I/O-rich systems within standard commercial temperature and voltage constraints.

Choosing this Spartan®-3A DSP device provides scalable capacity for mid- to high-complexity designs, with specifications that support long-term integration into systems requiring programmable logic, embedded memory, and extensive interfacing.

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