XC3SD3400A-5CSG484C
| Part Description |
Spartan®-3A DSP Field Programmable Gate Array (FPGA) IC 309 2322432 53712 484-FBGA, CSPBGA |
|---|---|
| Quantity | 60 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-CSPBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-FBGA, CSPBGA | Number of I/O | 309 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 5968 | Number of Logic Elements/Cells | 53712 | ||
| Number of Gates | 3400000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2322432 |
Overview of XC3SD3400A-5CSG484C – Spartan®-3A DSP FPGA, 484-CSPBGA
The XC3SD3400A-5CSG484C is a Spartan®-3A DSP field programmable gate array (FPGA) from AMD. It combines a high count of configurable logic with on-chip memory and a substantial I/O complement to support signal-processing and general-purpose programmable logic tasks.
Key device attributes include 53,712 logic elements, approximately 2.32 Mbits of embedded memory, up to 309 I/Os, a supply range of 1.14 V to 1.26 V, and a commercial operating temperature range of 0 °C to 85 °C, delivered in a 484-CSPBGA (19 × 19) surface-mount package.
Key Features
- Core Logic 53,712 logic elements providing programmable fabric for custom logic and DSP-oriented implementations.
- Embedded Memory Approximately 2.32 Mbits of on-chip RAM to support buffering, lookup tables, and intermediate data storage.
- Gate Scale Approximately 3.4 million gates of logic capacity for complex designs and integration of multiple functions on a single device.
- I/O and Connectivity Up to 309 general-purpose I/Os to interface with peripherals, sensors, and external devices in I/O-dense applications.
- Power Operates from a 1.14 V to 1.26 V supply range to match low-voltage system rails.
- Package and Mounting Supplied in a 484-CSPBGA (19 × 19) surface-mount package (484-FBGA, CSPBGA) for compact board-level integration.
- Temperature and Grade Commercial grade device rated for operation from 0 °C to 85 °C to meet standard commercial environment requirements.
- Environmental Compliance RoHS compliant for adherence to common environmental and materials regulations.
Typical Applications
- DSP and signal processing The DSP-oriented Spartan®-3A architecture and available on-chip RAM support digital signal processing workloads and algorithm acceleration.
- I/O-intensive interfaces With up to 309 I/Os, the device suits designs that require broad external connectivity and parallel data paths.
- Programmable logic integration High logic element count and gate capacity enable consolidation of multiple logic functions and custom control logic on a single FPGA.
Unique Advantages
- High logic density: 53,712 logic elements and ~3.4 million gates provide capacity for sizeable custom logic and DSP blocks.
- Integrated RAM: Approximately 2.32 Mbits of embedded memory reduces the need for external memory in many buffering and data-path applications.
- Extensive I/O: Up to 309 I/Os enable flexible interfacing options for sensors, peripherals, and parallel buses.
- Compact package: 484-CSPBGA (19 × 19) surface-mount package offers a small footprint for space-constrained board designs.
- Low-voltage operation: 1.14 V to 1.26 V supply compatibility simplifies integration with low-voltage system rails.
- Compliance and commercial readiness: RoHS compliance and a 0 °C to 85 °C operating range support standard commercial deployments.
Why Choose XC3SD3400A-5CSG484C?
The XC3SD3400A-5CSG484C positions itself as a DSP-focused Spartan®-3A FPGA offering a balance of logic capacity, on-chip memory, and generous I/O in a compact CSPBGA package. Its specifications make it suitable for designs that require substantial programmable logic and embedded RAM while operating within common commercial temperature and low-voltage constraints.
This part is appropriate for engineering teams seeking a programmable, RoHS-compliant FPGA platform capable of consolidating multiple functions on a single device, simplifying board-level integration and helping manage BOM complexity.
Request a quote or submit a pricing inquiry for the XC3SD3400A-5CSG484C to receive current availability and pricing information.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








