XC3SD3400A-4FGG676C

The XC3SD3400A-4FGG676C is a Spartan®-3A DSP field programmable gate array (FPGA) from AMD, supplied in a 676-ball BGA package. It integrates 53,712 logic elements and approximately 2.32 Mbits of embedded memory to support compute- and data-intensive embedded designs.

With 469 I/O pins, a logic capacity of roughly 3.4 million gates, and a supply voltage range of 1.14 V to 1.26 V, this commercial-grade, surface-mount device targets applications requiring dense logic, significant on-chip RAM, and high pin-count connectivity within a 27×27 676-FBGA footprint.

Key Features

• Core Logic Capacity — 53,712 logic elements providing the programmable fabric needed for medium-to-high density digital logic implementations.
• Embedded Memory — Approximately 2.32 Mbits of on-chip RAM for buffering, FIFOs, and local data storage, useful for DSP and streaming applications.
• I/O Density — 469 general-purpose I/O pins to support parallel interfaces, wide data buses, and multiple peripheral connections.
• Gate Scale — Approximately 3,400,000 gates enabling complex combinational and sequential logic designs.
• Power Supply — Operates from 1.14 V to 1.26 V, allowing direct specification of system power requirements.
• Package & Mounting — 676-ball FBGA (27×27) package, surface-mount for compact, board-level integration.
• Operating Range — Commercial temperature rating from 0 °C to 85 °C for standard environmental conditions.
• Compliance — RoHS-compliant construction.

Typical Applications

• DSP and Signal Processing — The Spartan®-3A DSP architecture with substantial on-chip RAM supports finite impulse response filters, FFTs, and other streaming signal operations.
• High-Density I/O Systems — 469 I/Os accommodate wide buses, multi-channel interfaces, and board-level bridging tasks.
• Embedded Logic and Prototyping — Logic capacity and memory make the device suitable for embedded control, custom processing engines, and iterative hardware development.
• Data Buffering and Packet Processing — On-chip RAM and gate count support buffering, packet inspection, and data flow management functions.

Unique Advantages

• Balanced Logic and Memory: 53,712 logic elements combined with approximately 2.32 Mbits of embedded RAM provide a versatile platform for mixed compute-and-storage tasks.
• High I/O Count: 469 I/Os reduce external glue logic by enabling direct connections to multiple peripherals and parallel interfaces.
• Compact BGA Package: 676-FBGA (27×27) offers a high pin density in a surface-mount form factor for space-constrained PCBs.
• Commercial Temperature Rating: 0 °C to 85 °C operation fits a wide range of standard electronic products and development environments.
• Regulatory Compliance: RoHS compliance supports lead-free production requirements.

Why Choose XC3SD3400A-4FGG676C?

The XC3SD3400A-4FGG676C positions itself as a commercially graded Spartan®-3A DSP FPGA that combines sizable logic capacity, on-chip memory, and a high I/O count in a compact 676-FBGA package. These characteristics make it well suited for designers who need a programmable platform for signal processing, data buffering, and high-density interface applications.

Supplied by AMD and offered in a surface-mount package with RoHS compliance, this FPGA is appropriate for teams focused on board-level integration where logic density, embedded RAM, and pin count are key selection criteria. Its voltage and temperature specifications allow straightforward system-level power and thermal planning.

Request a quote or submit an inquiry to receive pricing and availability for the XC3SD3400A-4FGG676C. Our team can assist with lead times and order placement to support your design schedule.