XC3SD3400A-4FGG676I

The XC3SD3400A-4FGG676I is a Field Programmable Gate Array (FPGA) device in a 676-BGA package designed for DSP-focused and logic-dense implementations. With 53,712 logic elements, approximately 2.32 Mbits of embedded memory and a large I/O complement, it is intended for industrial applications that require substantial on-chip resources and flexible I/O connectivity.

Key Features

• Core Logic  53,712 logic elements supporting complex programmable logic and custom digital functions.
• Embedded Memory  Approximately 2.32 Mbits of on-chip RAM for buffering, data storage and intermediate processing.
• Gate Capacity  Approximately 3.4 million gates to support wide-ranging logic and DSP implementations.
• I/O Density  469 general-purpose I/O pins to interface with peripherals, sensors and external devices.
• Power Supply  Core voltage range of 1.14 V to 1.26 V for the device core power domain.
• Package & Mounting  676-BGA (supplier package: 676-FBGA, 27 × 27) in a surface-mount form factor for compact board designs.
• Operating Range  Industrial-grade operating temperature from −40 °C to 100 °C for deployment in harsher environments.
• Compliance  RoHS-compliant construction to meet environmental and manufacturing requirements.

Typical Applications

• Digital Signal Processing  DSP-oriented designs that leverage the device’s DSP heritage and on-chip resources for algorithm implementation.
• Industrial Control Systems  Control and automation equipment benefiting from industrial temperature rating and high I/O counts.
• High-Density I/O Systems  Applications requiring many external interfaces, such as data aggregation or peripheral bridging.
• Memory-Intensive Logic  Designs that need substantial embedded RAM for buffering, look-up tables or state storage.

Unique Advantages

• High Logic Capacity: 53,712 logic elements enable implementation of sizable digital systems on a single device, reducing external component count.
• Substantial On-Chip Memory: Approximately 2.32 Mbits of embedded RAM supports in-device buffering and local data processing without immediate external memory.
• Extensive I/O Count: 469 I/O pins provide flexibility to connect multiple peripherals, sensors and interfaces directly to the FPGA.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for dependable operation in demanding environmental conditions.
• Compact BGA Package: 676-FBGA (27×27) surface-mount package offers a high-density footprint for space-constrained PCBs.
• Regulatory Compliance: RoHS-compliant construction aligns with modern manufacturing and environmental standards.

Why Choose XC3SD3400A-4FGG676I?

The XC3SD3400A-4FGG676I combines a large logic fabric, meaningful embedded memory and a high I/O count in a compact 676-BGA package, positioning it for industrial designs that require integrated DSP and logic capabilities. Its specified core voltage range and industrial temperature rating make it suitable where stable operation across environments is required.

Designers building mid- to large-scale programmable logic systems will find the device’s balance of logic elements, on-chip RAM and I/O density useful for consolidating functionality and lowering overall system complexity. The RoHS-compliant construction supports contemporary manufacturing and environmental expectations.

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