XC3SD3400A-4FG676C

The XC3SD3400A-4FG676C is a Spartan®-3A DSP field programmable gate array (FPGA) from AMD, delivered in a 676‑ball fine-pitch BGA (27×27) package for surface-mount assembly. Designed for DSP-capable FPGA designs, the device integrates a high logic capacity, substantial embedded memory, and a large number of I/O to address demanding programmable-logic and signal-processing applications.

This commercial-grade device operates from a 1.14 V to 1.26 V supply and is specified for 0 °C to 85 °C operation, offering a balance of integration and practical thermal and power characteristics for mainstream electronic systems. It is RoHS compliant.

Key Features

• Core Capacity  Provides 53,712 logic elements and approximately 3.4 million gates to implement complex digital logic and DSP functions.
• Embedded Memory  Approximately 2.32 Mbits of on-chip RAM for buffering, lookup tables, and intermediate data storage used in signal processing and control logic.
• I/O Density  469 user I/Os enable extensive interfacing to peripherals, high-speed buses, and I/O-rich system designs.
• Package and Mounting  676‑FBGA (27×27) package in a surface-mount format provides a compact, high-density footprint for board-level integration.
• Power  Operates from a 1.14 V to 1.26 V supply range suitable for modern low-voltage logic domains.
• Thermal and Grade  Commercial grade device rated for 0 °C to 85 °C ambient operation, appropriate for standard commercial electronics deployments.
• Standards  RoHS compliant for reduced environmental impact in manufacturing and assembly.

Typical Applications

• Digital Signal Processing  DSP-oriented FPGA fabrics for filtering, transforms, and real-time signal manipulation leveraging the device’s DSP designation and embedded memory.
• High-Density Programmable Logic  Implement complex state machines, custom accelerators, and combinational/sequential logic using the device’s large logic element count and gate equivalent capacity.
• I/O-Intensive Systems  Systems requiring many external connections—such as multi-channel interfaces or protocol bridging—can use the XC3SD3400A’s 469 I/Os for broad peripheral support.

Unique Advantages

• High Logic Integration: 53,712 logic elements and ~3.4M gates enable consolidated implementation of complex logic and DSP blocks, reducing the need for multiple discrete devices.
• Substantial On-Chip Memory: Approximately 2.32 Mbits of embedded RAM provides local storage for data buffering and lookup functions, improving data-path efficiency.
• Large I/O Count: 469 I/Os support extensive external connectivity, simplifying board-level routing for multi-interface designs.
• Compact BGA Footprint: 676‑FBGA (27×27) delivers high integration in a compact surface-mount package for space-constrained PCBs.
• Low-Voltage Operation: 1.14 V to 1.26 V supply range aligns with modern low-voltage system architectures to help minimize overall power draw.
• Commercial Temperature Range: Rated 0 °C to 85 °C for reliable operation in mainstream commercial environments.

Why Choose XC3SD3400A-4FG676C?

The XC3SD3400A-4FG676C positions itself as a DSP-capable, high-density FPGA option for designers who require a balance of logic resources, embedded memory, and extensive I/O in a single commercial-grade package. Its combination of 53,712 logic elements, approximately 2.32 Mbits of on-chip RAM, and 469 I/Os makes it suitable for implementing complex programmable logic and signal-processing tasks without excessive board-level component count.

Manufactured by AMD and supplied in a 676‑FBGA surface-mount package, this device offers a compact, RoHS-compliant solution for mainstream FPGA designs operating within standard commercial temperature and low-voltage supply constraints.

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