XC3SD3400A-4CSG484C

The XC3SD3400A-4CSG484C is a Spartan®-3A DSP field programmable gate array (FPGA) from AMD supplied in a 484-CSPBGA (19×19) package. It integrates DSP-oriented FPGA resources to address applications that require significant logic density, on-chip memory, and a high I/O count within a compact surface-mount footprint.

Targeted at commercial-temperature designs, this device provides a balance of logic capacity, embedded RAM, and I/O connectivity while operating from a 1.14 V to 1.26 V supply and a 0 °C to 85 °C temperature range.

Key Features

• FPGA Core and Architecture Spartan®-3A DSP field programmable gate array architecture optimized for DSP-oriented designs.
• Logic Resources 5,968 CLBs and 53,712 logic elements to implement complex custom logic and datapaths.
• Embedded Memory Approximately 2.32 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
• Gate Count Approximately 3,400,000 gates providing substantial integration for medium-to-high complexity functions.
• I/O Capacity 309 user I/Os for flexible interface options and external connectivity.
• Power Core supply range of 1.14 V to 1.26 V for compatibility with specified power architectures.
• Package and Mounting 484‑FBGA (CSPBGA) 19×19 package in a surface-mount form factor suitable for space-constrained PCBs.
• Temperature and Grade Commercial grade operation from 0 °C to 85 °C.
• Environmental Compliance RoHS compliant.

Typical Applications

• DSP Acceleration Use the Spartan-3A DSP architecture for digital signal processing tasks that benefit from dedicated FPGA resources and on-chip memory.
• Embedded Logic and Control Implement custom control logic, state machines, and glue logic in systems requiring substantial logic elements and I/O.
• Interface Concentration Aggregate and bridge multiple peripheral interfaces using the device’s high I/O count and embedded memory for buffering.

Unique Advantages

• High Logic Capacity: 53,712 logic elements and 5,968 CLBs provide the resources to consolidate multiple functions into a single device, reducing BOM count.
• Significant On-Chip RAM: Approximately 2.32 Mbits of embedded memory supports data buffering and low-latency storage without external RAM.
• Extensive I/O: 309 I/Os enable flexible connectivity to peripherals, sensors, and external interfaces.
• Compact, Surface-Mount Package: The 484‑CSPBGA (19×19) package delivers a dense, board-friendly footprint for space-constrained designs.
• Commercial Temperature Range: Rated for 0 °C to 85 °C to meet typical commercial application requirements.
• Regulatory Compliance: RoHS compliance supports environmental requirements for modern electronics manufacturing.

Why Choose XC3SD3400A-4CSG484C?

The XC3SD3400A-4CSG484C positions Spartan-3A DSP FPGA capability into a compact 484-CSPBGA package, combining substantial logic density, embedded memory, and a high I/O count for commercial-temperature designs. Its specified core voltage range and RoHS compliance make it suitable for a range of OEM and embedded applications that require DSP-focused FPGA resources.

This device is well suited for engineers seeking to integrate DSP-enabled FPGA functions with on-chip memory and extensive I/O in a single, surface-mount component, offering a balance of integration, scalability, and vendor-backed architecture for longer-term projects.

Request a quote or submit a pricing inquiry for the XC3SD3400A-4CSG484C to evaluate suitability for your next design.