XC3SD1800A-5FGG676C

The XC3SD1800A-5FGG676C is a Spartan®-3A DSP field programmable gate array provided by AMD, combining DSP-oriented FPGA architecture with substantial logic and I/O resources. It targets designs that require dense logic capacity, embedded memory, and a high I/O count in a compact surface-mount package.

This commercial-grade, RoHS-compliant device offers 37,440 logic elements, approximately 1.55 Mbits of on-chip RAM, and 519 I/Os, all delivered in a 676-BGA (676-FBGA 27×27) package with a core voltage range of 1.14–1.26 V and an operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity  37,440 logic elements and 4,160 CLBs provide significant programmable logic resources for complex digital designs.
• Embedded Memory  Approximately 1.55 Mbits of on-chip RAM supports buffering, FIFOs, and data-centric DSP functions without relying solely on external memory.
• DSP-Oriented Architecture  Spartan®-3A DSP family designation indicates architecture optimized for digital signal processing tasks and algorithm acceleration.
• I/O Density  519 I/O pins enable broad peripheral connectivity and support for multi-channel front-end interfaces or parallel buses.
• Gate Count  Approximately 1,800,000 gates for high-density logic implementations and integration of multiple subsystems on a single device.
• Package and Mounting  676-BGA (supplier package: 676-FBGA 27×27) surface-mount package provides a compact footprint for space-constrained PCBs.
• Power and Thermal  Core supply range of 1.14–1.26 V and commercial operating temperature range of 0 °C to 85 °C align with typical board-level power and environmental constraints.
• Compliance  RoHS compliant for lead-free assembly and regulatory alignment in commercial products.

Typical Applications

• Digital Signal Processing  DSP-optimized FPGA resources and on-chip RAM enable acceleration of filters, transforms, and real-time signal algorithms.
• High-Density Logic Integration  Large logic element and gate counts allow consolidation of multiple control and processing functions onto a single device to reduce system BOM.
• I/O-Intensive Systems  With 519 I/Os, the device is suited for applications requiring numerous parallel interfaces, sensor arrays, or multi-channel data capture.
• Embedded Platform Development  The combination of logic, RAM, and I/O density supports prototyping and deployment of custom embedded processing solutions.

Unique Advantages

• High Integration Density: 37,440 logic elements and ~1.8 million gates let designers implement complex functions and reduce external components.
• On-Chip Memory for Real-Time Tasks: Approximately 1.55 Mbits of embedded RAM provides on-chip storage for buffering and low-latency data paths.
• Extensive I/O Count: 519 I/Os enable flexible system interfacing without immediate need for large external I/O expanders.
• Compact, Surface-Mount Package: 676-BGA (676-FBGA 27×27) delivers a high-pin-count solution in a compact form factor for board-level space savings.
• Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for broad commercial product deployment.
• Defined Core Supply Range: Core voltage support of 1.14–1.26 V provides clear power design parameters for system integration.

Why Choose XC3SD1800A-5FGG676C?

The XC3SD1800A-5FGG676C positions itself as a high-capacity, DSP-oriented FPGA that balances logic density, embedded memory, and extensive I/O in a compact 676-BGA package. Its specification set—37,440 logic elements, approximately 1.55 Mbits of on-chip RAM, 519 I/Os, and ~1.8M gates—makes it well suited for designers consolidating processing, control, and I/O functions on a single programmable device.

Engineers and procurement teams seeking a RoHS-compliant, commercial-grade FPGA with clearly defined power and temperature parameters can leverage this device for scalable embedded and DSP-focused designs where on-chip resources and I/O density are critical.

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