XC3SD3400A-4CS484C

The XC3SD3400A-4CS484C is a Spartan®-3A DSP field programmable gate array (FPGA) supplied in a 484-pin CSPBGA/FBGA package. It combines a DSP-class architecture with substantial programmable logic and on-chip memory resources for digital signal processing and logic-intensive designs.

Key device attributes include 5,968 configurable logic blocks (CLBs), 53,712 logic elements, approximately 2.32 Mbits of embedded memory, 309 user I/O pins, and support for a 1.14 V to 1.26 V core supply, packaged for surface-mount assembly and specified for commercial temperature operation (0°C to 85°C).

Key Features

• Core / Architecture Spartan-3A DSP family FPGA with 5,968 configurable logic blocks (CLBs) and 53,712 logic elements to implement DSP and complex logic functions.
• Logic Capacity Approximately 3,400,000 equivalent gates of logic capacity for medium- to high-density designs.
• Embedded Memory Approximately 2.32 Mbits of on-chip RAM to support buffering, data storage, and intermediate processing.
• I/O 309 user I/O pins to enable broad connectivity to peripherals, interfaces, and external logic.
• Power Core voltage supported from 1.14 V to 1.26 V for device operation.
• Package & Mounting 484-pin CSPBGA (484-CSPBGA, 19×19) / 484-FBGA package; surface-mount mounting type for compact board designs.
• Operating Range & Grade Commercial grade device specified for operation from 0°C to 85°C.
• Environmental Compliance RoHS compliant.

Typical Applications

• DSP and Signal Processing — Implements DSP algorithms and data-path processing leveraging the Spartan-3A DSP architecture and on-chip memory.
• Embedded Systems — Acts as a programmable logic engine for embedded control, protocol handling, and custom logic functions where moderate logic density and memory are required.
• High-density Logic Implementations — Suits applications that require tens of thousands of logic elements and millions of gates in a compact BGA package.

Unique Advantages

• High logic integration: 53,712 logic elements and ~3.4M equivalent gates provide substantial capacity for complex designs without external ASICs.
• Significant on-chip memory: Approximately 2.32 Mbits of embedded RAM supports buffering and intermediate data storage for DSP and control tasks.
• Generous I/O count: 309 user I/O pins enable flexible interfacing and system integration options.
• Compact, surface-mount BGA package: The 484-CSPBGA (19×19) package allows for dense board layouts while maintaining robust connectivity.
• Commercial temperature and RoHS compliance: Specified for 0°C to 85°C operation and RoHS compliant for standard commercial product deployments.

Why Choose XC3SD3400A-4CS484C?

The XC3SD3400A-4CS484C positions itself as a programmable, DSP-oriented FPGA that balances logic capacity, embedded memory, and I/O count in a compact BGA package. Its combination of 5,968 CLBs, 53,712 logic elements, and approximately 2.32 Mbits of on-chip RAM makes it well suited for designers who need substantial programmable resources for signal processing and logic-heavy tasks within commercial-temperature applications.

For teams targeting scalable, reconfigurable hardware solutions that require integration of processing and logic in a single device, this Spartan-3A DSP FPGA delivers a verified set of capabilities and environmental compliance appropriate for commercial electronic products.

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