XC3SD1800A-5CSG484C

The XC3SD1800A-5CSG484C is a Spartan®-3A DSP Field Programmable Gate Array (FPGA) IC from AMD offered in a 484‑FBGA (484‑CSPBGA 19×19) package. It combines substantial logic capacity with embedded RAM and a large I/O count to address DSP-focused and general-purpose FPGA designs.

Specified for commercial-grade applications, this device supports a supply voltage range of 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C, and it is RoHS compliant.

Key Features

• Logic Capacity  Provides 37,440 logic elements for implementing medium-to-high complexity digital designs.
• Embedded Memory  Contains approximately 1.55 Mbits of on-chip RAM to support buffering, FIFOs, and DSP data storage without relying on external memory.
• DSP and Gate Count  Designed for DSP-oriented applications with an estimated 1,800,000 gates of logic capacity to handle arithmetic and signal-processing workloads.
• I/O Density  Offers 309 user I/O pins for broad interfacing options to peripherals, sensors, and external logic.
• Package and Mounting  Supplied in a 484‑CSPBGA (19×19) surface-mount package suitable for compact board layouts.
• Power  Operates from a core supply range of 1.14 V to 1.26 V to match appropriate power-rail designs.
• Thermal and Grade  Commercial-grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for designs targeting regulated markets.

Typical Applications

• DSP Acceleration  Hardware acceleration of digital signal processing algorithms leveraging the Spartan‑3A DSP architecture and sizeable on-chip memory.
• Embedded Processing  Custom logic and control functions that benefit from a high logic element count and substantial gate capacity.
• I/O‑Intensive Interfaces  Systems requiring many external connections—such as data acquisition front ends and protocol bridging—can utilize the device's 309 I/O pins.

Unique Advantages

• Substantial Logic Resources: 37,440 logic elements enable implementation of complex finite-state machines, pipelines, and custom processing blocks without partitioning across multiple devices.
• On‑Chip Memory Reduces External BOM: Approximately 1.55 Mbits of embedded RAM supports buffering and workspace needs, lowering dependence on external memory components.
• High I/O Count: 309 user I/Os provide flexibility for multi-channel interfaces, parallel data buses, and mixed-signal front ends.
• Compact Surface‑Mount Package: 484‑CSPBGA (19×19) packaging delivers a dense footprint for space-constrained PCBs while maintaining solderable surface-mount mounting.
• Commercial‑Grade Operating Range: Rated 0 °C to 85 °C for typical commercial applications and environments.
• Standards‑Aware Manufacturing: RoHS compliance supports regulatory and supply-chain requirements for many production programs.

Why Choose XC3SD1800A-5CSG484C?

The XC3SD1800A-5CSG484C positions itself as a flexible Spartan‑3A DSP FPGA option for engineers who need a balance of logic density, embedded memory, and a high number of I/Os in a compact surface‑mount package. Its specifications suit designs that require on-chip data storage and signal processing capability while maintaining a moderate commercial temperature range and RoHS compliance.

This device is well suited for development teams and procurement groups building DSP-centric and mid- to high-density FPGA systems that prioritize integration, I/O flexibility, and a compact board footprint.

Request a quote or submit a purchase inquiry to receive pricing, availability, and lead-time information for the XC3SD1800A-5CSG484C.